Sputtering Growth of Metal Oxynitride Semiconductors for Excitonic Devices

Sputtering Growth of Metal Oxynitride Semiconductors for Excitonic Devices
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用于激子器件的金属氮氧化物半导体的溅射生长

DOI:
10.1109/edtm50988.2021.9420921
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发表时间:
2021
期刊:
Proc. 5th IEEE Electron Devices Technology & Manufacturing Conference
影响因子:
--
通讯作者:
Shiratani Masaharu
Shiratani Masaharu
中科院分区:
--
文献类型:
--
作者:
Narishige Ryota;Itagaki Naho;Shiratani Masaharu

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研究了衬底表面极性对溅射沉积(ZnO)x(InN)1-x(以下简称“锡安”)薄膜生长的影响。采用射频磁控溅射方法在锌面和O面的氧化锌衬底上沉积了锡安薄膜。在锌面衬底上的Zion薄膜表面粗糙,均方根(RMS)粗糙度为4.30 nm,而在O面氧化锌衬底上的Zion薄膜表面光滑,RMS粗糙度为2.71 nm。这一结果归因于衬底表面锌离子迁移率的差异。
Effects of substrate surface polarity on the growth of sputter-deposited (ZnO)x(InN)1-x(called “ZION” hereinafter) films have been investigated. ZION films were deposited on Zn-face and O-face ZnO substrates by radio-frequency magnetron sputtering. The ZION film on the Zn-face substrate has rough surface with the root mean square (RMS) roughness of 4.30 nm, whereas, the ZION film on O-face ZnO substrate has smooth surface with the RMS roughness of 2.71 nm. This result is attributed to the difference in Zn mobility on the substrate surfaces.
DOI: 10.1002/pssb.200304189
发表时间: 2004-03
期刊: physica status solidi (b)
影响因子: --
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期刊:
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