Laser Structuring of Thin Layers for Flexible Electronics by a Shock Wave-induced Delamination Process
Laser Structuring of Thin Layers for Flexible Electronics by a Shock Wave-induced Delamination Process
复制标题
通过冲击波诱导分层工艺对柔性电子器件薄层进行激光结构化
DOI：
10.1016/j.phpro.2014.08.013
复制
发表时间：
2014
期刊：
影响因子：
--
通讯作者：
K. Zimmer
中科院分区：
文献类型：
--
作者：
P. Lorenz;M. Ehrhardt;K. Zimmer
柔性基板上薄膜的无缺陷激光辅助结构化对激光方法来说是一个挑战。然而，解决这个问题为柔性电子产品的开拓性发展展现了巨大的潜力。因此，激光辅助分层方法具有很大的应用潜力。在分层过程中：由基板背面激光烧蚀过程产生的冲击波引起层的局部去除。在本研究中，使用 KrF 准分子激光器根据材料和激光参数研究了不同聚合物基板的薄膜图案化工艺。通过光学显微镜和白光干涉测量法（WLI）研究了所得结构。在不同的样品（聚对苯二甲酸乙二醇酯（PET）上的氧化铟锡（ITO）、聚酰亚胺（PI）上的环氧基负性光刻胶（SU8）以及PI上的氧化铟锡/铜铟镓硒/钼（ITO/CIGS/Mo））上测试了分层过程。
The defect-free laser-assisted structuring of thin films on flexible substrates is a challenge for laser methods. However, solving this problem exhibits an outstanding potential for a pioneering development of flexible electronics. Thereby, the laser-assisted delamination method has a great application potential. At the delamination process: the localized removal of the layer is induced by a shock wave which is produced by a laser ablation process on the rear side of the substrate. In this study, the thin-film patterning process is investigated for different polymer substrates dependent on the material and laser parameters using a KrF excimer laser. The resultant structures were studied by optical microscopy and white light interferometry (WLI). The delamination process was tested at different samples (indium tin oxide (ITO) on polyethylene terephthalate (PET), epoxy-based negative photoresist (SU8) on polyimide (PI) and indium tin oxide/copper indium gallium selenide/molybdenum (ITO/CIGS/Mo) on PI.
聚酰亚胺载体箔背面激光烧蚀诱导 CIGS 薄膜图案化
DOI：
10.1007/s00339-013-7962-2
发表时间：
2013
期刊：
Applied Physics A
影响因子：
--
作者：
M. Ehrhardt;A. Wehrmann;P. Lorenz;K. Zimmer
通讯作者：
K. Zimmer
激光诱导正向转移：基于激光的生物分子打印技术
影响因子：
19
作者：
P. Serra;M. Duocastella;J. Fernández;J. Morenza
通讯作者：
J. Morenza