Genes involved in copper resistance influence survival of Pseudomonas aeruginosa on copper surfaces.
Genes involved in copper resistance influence survival of Pseudomonas aeruginosa on copper surfaces.
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DOI：
10.1111/j.1365-2672.2009.04148.x
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发表时间：
2009-05
影响因子：
4
通讯作者：
Rensing C
中科院分区：
文献类型：
--
作者：
Elguindi J;Wagner J;Rensing C
评价铜绿假单胞菌PAO 1对铜合金的杀灭作用及基因对含铜介质和表面上铜绿假单胞菌存活的影响。将不同的铜绿假单胞菌接种在含铜培养基或不同的铜合金上，测定其存活率。将存活率与无铜培养基和不锈钢作为对照进行比较。此外，还研究了温度对存活率的影响。铜铸造合金先前已被证明对各种细菌具有杀菌作用，但铜介导的杀灭机制仍不清楚。在这份报告中，我们证明，铜绿假单胞菌PAO1被迅速杀死不同的铜铸造合金和基因参与赋予铜电阻在含铜介质中也影响铜铸造合金的生存。我们还表明，杀死率是受温度。
To evaluate the killing of Pseudomonas aeruginosa PAO1 on copper cast alloys and the influence of genes on survival on copper containing medium and surfaces. Different strains of P. aeruginosa were inoculated on copper containing medium or different copper cast alloys and the survival rate determined. The survival rates were compared to rates on copper-free medium and stainless steel as control. In addition, the effect of temperature on survival was examined. Copper cast alloys had previously shown to be bactericidal to various bacteria but the mechanism of copper-mediated killing is still not known. In this report we demonstrate that P. aeruginosa PAO1 is rapidly killed on different copper cast alloys and that genes involved in conferring copper resistance in copper-containing medium also influenced survival on copper cast alloys. We also show that the rate of killing is influenced by temperature.
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影响因子：
11.8
作者：
Livermore, DM
通讯作者：
Livermore, DM
DOI：
10.1016/j.ijfoodmicro.2006.04.037
发表时间：
2006-09-01
影响因子：
5.4
作者：
Wilks, Sandra A.;MichelS, Harold T.;Keevil, C. William
通讯作者：
Keevil, C. William
影响因子：
4.4
作者：
Noyce, J. O.;Michels, H.;Keevil, C. W.
通讯作者：
Keevil, C. W.
影响因子：
6.9
作者：
Noyce, J. O.;Michels, H.;Keevil, C. W.
通讯作者：
Keevil, C. W.
影响因子：
4.2
作者：
Faúndez G;Troncoso M;Navarrete P;Figueroa G
通讯作者：
Figueroa G