A Contact-Sensitive Probe for Biomedical Optics.

A Contact-Sensitive Probe for Biomedical Optics.
复制标题

DOI:
10.3390/s22062361
复制
发表时间:
2022-03-18
期刊:
Sensors (Basel, Switzerland)
影响因子:
--
通讯作者:
Franceschini MA
Franceschini MA
中科院分区:
其他
文献类型:
--
作者:
Renna M;Peruch A;Sunwoo J;Starkweather Z;Martin A;Franceschini MA

文献摘要

参考文献

相似文献

电容式接近传感在我们的日常生活中很普遍,但没有用于生物医学光学的传感器利用该技术来监测探针附着到受试者皮肤上的情况。特别是,当使用光学监测设备时,定量测量探头接触的能力可以显著提高数据质量并确保受试者的安全。我们提出了一种基于柔性印刷电路板的定制新型光学探头,该柔性印刷电路板集成了电容式接触传感器、3D打印光纤支架和加速度计传感器。在连续监测光学测量过程中,可有效采用该设备,以检测接触质量、运动伪影、探头分离并确保最佳信号质量。
Capacitive proximity sensing is widespread in our everyday life, but no sensor for biomedical optics takes advantage of this technology to monitor the probe attachment to the subject’s skin. In particular, when using optical monitoring devices, the capability to quantitatively measure the probe contact can significantly improve data quality and ensure the subject’s safety. We present a custom novel optical probe based on a flexible printed circuit board which integrates a capacitive contact sensor, 3D-printed optic fiber holders and an accelerometer sensor. The device can be effectively adopted during continuous monitoring optical measurements to detect contact quality, motion artifacts, probe detachment and ensure optimal signal quality.
DOI: 10.3390/s21030870
发表时间: 2021-01-28
期刊: Sensors (Basel, Switzerland)
影响因子: --
作者:
Amendola C;Lacerenza M;Buttafava M;Tosi A;Spinelli L;Contini D;Torricelli A
通讯作者: Torricelli A
DOI: 10.1016/j.neuroimage.2020.117490
发表时间: 2021-01-15
期刊: NEUROIMAGE
影响因子: 5.7
作者:
Frijia, Elisabetta Maria;Billing, Addison;Cooper, Robert J.
通讯作者: Cooper, Robert J.
DOI: 10.1108/02602281011010772
发表时间: 2010-01-01
期刊: SENSOR REVIEW
影响因子: 1.6
作者:
Hu, Xiaohui;Yang, Wuqiang
通讯作者: Yang, Wuqiang
用于评估复合绝缘子老化的新型电容式接近传感器
DOI: 10.1016/j.sna.2016.11.025
发表时间: 2017-01-01
影响因子: 4.6
作者:
Jiao, Jingpin;Li, Liang;He, Cunfu
通讯作者: He, Cunfu
DOI: 10.1155/2020/3905804
发表时间: 2020-03-04
期刊: JOURNAL OF SENSORS
影响因子: 1.9
作者:
Morais, Flavio;Carvalhaes-Dias, Pedro;Dias, Jose Siqueira
通讯作者: Dias, Jose Siqueira