Modulation on the electronic properties and band gap of layered ReSe2 via strain engineering
Modulation on the electronic properties and band gap of layered ReSe2 via strain engineering
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通过应变工程调制层状 ReSe2 的电子特性和带隙
DOI:
10.1016/j.jallcom.2020.154364
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发表时间:
2020-06
影响因子:
6.2
通讯作者:
Shan Chongxin
中科院分区:
文献类型:
--
作者:
Liu Yiming;Li Xing;Guo Yao;Yang Tao;Chen Kaijian;Lin Chaonan;Wei Jianyong;Liu Qian;Lu Yingjie;Dong Lin;Shan Chongxin
Two-dimensional (2D) materials have drawn tremendous attention due to their planar nature, good mechanical, optical and electrical properties especially for flexible electronic devices whose performance could be modulated by external mechanical strains. Here, the piezoresistive property of layered ReSe2upon various homogeneous strains is investigated. Highly sensitive and reliable response in resistance has been observed for ReSe2-based flexible devices under tensile/compressive strains. Photoluminescence spectra measurement further confirmed the strain modulation on the band gap energy, leading to the piezoresistive property in ReSe2. Additionally, it is found that the electromechanical behavior of ReSe2can be greatly influenced by the directions of applied strains, where the gauge factor is 4.29 times higher when the strain is applied along theb-axis than that obtained under strain perpendicular tob-axis. The strain-direction-sensitive electromechanical behavior can be attributed to the different band gap change induced by strains along various directions. These results can contribute to the design, performance improvement and application development of flexible electronic devices based on anisotropic 2D materials.
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影响因子:
3.1
作者:
RAJANNA, K;MOHAN, S;MUTHUNAYAGAM, AE
通讯作者:
MUTHUNAYAGAM, AE
影响因子:
10.8
作者:
Manzeli, Sajedeh;Allain, Adrien;Kis, Andras
通讯作者:
Kis, Andras
影响因子:
9.9
作者:
Huan Zhao;Jiangbin Wu;Hongxia Zhong;Qiushi Guo;Xiaomu Wang;Fengnian Xia;Li Yang;Ping-Heng Tan;Han Wang
通讯作者:
Han Wang
影响因子:
10.8
作者:
Qing Yang;Y. Liu;Caofeng Pan;Jun Chen;X. Wen;Zhong Lin Wang
通讯作者:
Qing Yang;Y. Liu;Caofeng Pan;Jun Chen;X. Wen;Zhong Lin Wang
影响因子:
3.7
作者:
Alyoruk, M. Menderes;Aierken, Yierpan;Sevik, Cem
通讯作者:
Sevik, Cem