Automated Nanoscale Absolute Accuracy Alignment System for Transfer Printing.
Automated Nanoscale Absolute Accuracy Alignment System for Transfer Printing.
复制标题
自动纳米级绝对准确性对准系统，用于传输打印。
DOI：
10.1021/acsanm.0c02224
复制
发表时间：
2020-10-23
影响因子：
5.9
通讯作者：
Strain MJ
中科院分区：
文献类型：
--
作者：
McPhillimy J;Jevtics D;Guilhabert BJE;Klitis C;Hurtado A;Sorel M;Dawson MD;Strain MJ
微纳米器件与片上电路和波导平台的异构集成是一项关键的使能技术，在电信、量子信息处理和传感等领域具有广泛的应用。在纳米级的绝对位置精度的拾取和放置集成先前已被证明为单个原理验证设备。然而，为了实现多元件系统或高通量制造，该技术的规模化，集成过程必须与自动化兼容，同时保持纳米级精度。在这项工作中，自动转移印刷过程中实现了通过使用一个简单的光学显微镜，计算机视觉，和高精度的平移台系统。使用互相关图像处理方法的自动对准证明了对于薄膜硅膜和单纳米线器件两者的串联器件集成具有<40 nm（3σ < 390 nm）的平均偏移的转移的绝对位置精度。器件在2 × 2 mm 2面积上的平行转移证明了平均偏移<30 nm（3σ < 705 nm）。所有器械变体的旋转精度均优于45 mrad。可以从其原生衬底上的光刻限定的位置或从随机分布的群体中选择器件并将其以高精度放置在目标衬底上。这些演示为未来异构集成芯片系统的可扩展制造铺平了道路。
The heterogeneous integration of micro- and nanoscale devices with on-chip circuits and waveguide platforms is a key enabling technology, with wide-ranging applications in areas including telecommunications, quantum information processing, and sensing. Pick and place integration with absolute positional accuracy at the nanoscale has been previously demonstrated for single proof-of-principle devices. However, to enable scaling of this technology for realization of multielement systems or high throughput manufacturing, the integration process must be compatible with automation while retaining nanoscale accuracy. In this work, an automated transfer printing process is realized by using a simple optical microscope, computer vision, and high accuracy translational stage system. Automatic alignment using a cross-correlation image processing method demonstrates absolute positional accuracy of transfer with an average offset of <40 nm (3σ < 390 nm) for serial device integration of both thin film silicon membranes and single nanowire devices. Parallel transfer of devices across a 2 × 2 mm2 area is demonstrated with an average offset of <30 nm (3σ < 705 nm). Rotational accuracy better than 45 mrad is achieved for all device variants. Devices can be selected and placed with high accuracy on a target substrate, both from lithographically defined positions on their native substrate or from a randomly distributed population. These demonstrations pave the way for future scalable manufacturing of heterogeneously integrated chip systems.
登录
查看更多内容
影响因子：
2.1
作者：
Thomson, David;Zilkie, Aaron;Nedeljkovic, M.
通讯作者：
Nedeljkovic, M.
影响因子：
3.4
作者：
Dupont, A.;Stirnnagel, K.;Lamb, D. C.
通讯作者：
Lamb, D. C.
影响因子：
11
作者：
Estevez, M-Carmen;Alvarez, Mar;Lechuga, Laura M.
通讯作者：
Lechuga, Laura M.
影响因子：
19.4
作者：
Bao, Qingyang;Li, Weijia;Tong, Limin
通讯作者：
Tong, Limin
影响因子：
2.3
作者：
Anderson, EH;Ha, D;Liddle, JA
通讯作者：
Liddle, JA