Improving high temperature tribological performances of Si doped diamond-like carbon by using W interlayer
Improving high temperature tribological performances of Si doped diamond-like carbon by using W interlayer
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利用W中间层提高Si掺杂类金刚石碳的高温摩擦性能
DOI:
10.1016/j.triboint.2020.106241
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发表时间:
2020-06
影响因子:
6.2
通讯作者:
Linqing Wang
中科院分区:
文献类型:
--
作者:
Weijie Yu;Junjun Wang;Weijiu Huang;Longchen Cui;Linqing Wang
Diamond-like carbon films (DLC) with different silicon contents combined with W interlayer are deposited by plasma-assisted reactive magnetron sputtering. The structures and high-temperature tribological properties of the films are investigated. The results reveal that the pure DLC film is worn out at 400 oC because of graphitization, while the Si-DLC film with Si content of 4.56 at.% keeps low friction coefficient (0.2–0.05) at high temperature up to 500 oC. The 14.56 at.% Si-DLC film failed at 500 oC induced by the formation of SiO2. The improved high-temperature tribological performance of the 4.56 at.% Si-DLC film is attributed to the tribochemistry of W interlayer at 500 oC which formed a film composed of tungsten oxides and carbide.
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