Failure mechanisms of diamond like carbon coatings characterised by in situ SEM scratch testing
Failure mechanisms of diamond like carbon coatings characterised by in situ SEM scratch testing
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原位 SEM 划痕测试表征类金刚石碳涂层的失效机制
作者：
Bird A
使用半径为 1 和 5 μm 的尖锐金刚石粗糙体对沉积在 Si <100> 晶圆上的 DLC 和硅掺杂 DLC 进行了原位 SEM 划痕测试，从而能够实时评估 DLC 涂层的变形和磨损阶段。随着载荷的增加，划痕轨迹中的初始塑性变形和拉伸裂纹逐渐发展为径向和横向裂纹的扩展以及整个涂层剥落。原位 SEM 成像揭示了移动凹凸体正面和侧面周围 DLC 涂层中径向裂纹的成核，随后横向裂纹在凹凸体接触区的前方和后方扩展。尸检 FIB 横截面显示，在涂层剥落之前，DLC 涂层下方的硅基板中存在微裂纹和横向裂纹。 DLC 失效机制受到粗糙几何形状的影响，在较小的 1 μm 半径粗糙划痕测试中会发生明显的 DLC 涂层翘起/分层事件。与较大的 5 μm 粗糙体相比，更尖锐的 1 μm 半径粗糙体需要约 20% 的外加载荷和更高的接触压力，才能在刮擦过程中引发剥落，这表明较小半径的粗糙体更容易导致 DLC 涂层剥落，尽管观察到它们产生的剥落平均较小。
In situ SEM scratch testing of DLC and Si-doped DLC deposited on Si < 100> wafers has been conducted using sharp 1 and 5 μm radii diamond asperities, enabling the stages of deformation and wear of DLC coatings to be evaluated in real time. With increasing load, initial plastic deformation and tensile cracking in the scratch track progresses to the propagation of radial and lateral cracks, and full coating spallation. In situ SEM imaging reveals nucleation of radial cracks in the DLC coating around the front and side of the moving asperity, followed by lateral crack propagation both ahead of, and behind, the asperity contact zone. Post-mortem FIB cross sectioning reveals microcracking and lateral cracks in the silicon substrate below DLC coatings prior to coating spallation. The DLC failure mechanisms are influenced by asperity geometry, with notable DLC coating lift up/delamination events occurring during the smaller 1 μm radius asperity scratch tests. The sharper 1 μm radius asperity required ∼20% of the applied load, and higher contact pressure, to initiate spallation during scratching compared the larger 5 μm asperity, indicating that smaller radii asperities are significantly more likely to cause DLC coating spallation, although the spallations they generate were observed to be, on average, smaller.
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