Flow frictional characteristics of microencapsulated phase change material suspensions flowing through rectangular minichannels
Flow frictional characteristics of microencapsulated phase change material suspensions flowing through rectangular minichannels
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微胶囊相变材料悬浮液流经矩形微通道的流动摩擦特性
DOI：
10.1007/s11431-006-0445-3
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发表时间：
2006-08
期刊：
影响因子：
--
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中科院分区：
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对微胶囊相变材料（MEPCM）悬浮液在流经矩形铜微通道的水中的层流摩擦特性进行了实验研究。 MEPCM 的平均粒径为 4.97 μm，与蒸馏水混合形成质量浓度范围为 0 至 20% 的悬浮液。实验旨在探讨MEPCM质量浓度对微通道内摩擦系数和压降的影响。雷诺数范围为 200 至 2000，以提供层流和过渡流。结果发现，浓度为 0% 和 5% 的悬浮液的实验数据与不可压缩、充分发展的层流牛顿流的现有理论数据非常吻合。对于质量浓度高于10%的悬浮液，与层流牛顿流相比，摩擦系数和压降明显增加。
An experimental investigation was conducted on the laminar flow frictional characteristics of suspensions with microencapsulated phase change material (MEPCM) in water flowing through rectangular copper minichannels. The MEPCM was provided at an average particle size of 4.97 μm, and was mixed with distilled water to form suspensions with various mass concentrations ranging from 0 to 20%. The experiment was performed to explore the effect of MEPCM mass concentration on friction factor and pressure drop in the minichannels. The Reynolds number ranged from 200 to 2000 to provide laminar and transitional flows. It was found that the experimental data for the suspensions with 0 and 5% concentration agree well with the existing theoretical data for an incompressible, fully developed, laminar Newtonian flow. For the suspensions with mass concentrations higher than 10%, there is an obvious increase in friction factor and pressure drop in comparison with laminar Newtonian flow.
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影响因子：
5.6
作者：
J. Hartnett;T. Irvine;Young I Cho;G. Greene
通讯作者：
J. Hartnett;T. Irvine;Young I Cho;G. Greene
DOI：
10.1016/0017-9310(95)00327-4
发表时间：
1996-08-01
影响因子：
5.2
作者：
Peng, XF;Peterson, GP
通讯作者：
Peterson, GP
DOI：
10.1016/s0065-2717(16)30009-0
发表时间：
2016
期刊：
--
影响因子：
--
作者：
E. Sparrow;J. Gorman;J. Abraham
通讯作者：
E. Sparrow;J. Gorman;J. Abraham
影响因子：
64.8
作者：
V. Vand
通讯作者：
V. Vand
DOI：
10.1109/itherm.2000.866802
发表时间：
2000-05
期刊：
ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
影响因子：
--
作者：
I. Mudawar
通讯作者：
I. Mudawar