Machine Learning on the Thermal Side-Channel: Analysis of Accelerator-Rich Architectures
Machine Learning on the Thermal Side-Channel: Analysis of Accelerator-Rich Architectures
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热侧通道上的机器学习:富含加速器的架构分析
DOI:
10.1109/iccd.2018.00022
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发表时间:
2018
期刊:
影响因子:
--
通讯作者:
Hempstead, Mark
中科院分区:
文献类型:
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作者:
Werner, David;Juretus, Kyle;Savidis, Ioannis;Hempstead, Mark
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DOI:
10.1109/esscirc.2017.8094523
发表时间:
2017
期刊:
ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference
影响因子:
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作者:
Arvind Singh;Monodeep Kar;S. Mathew;Anand Rajan;V. De;S. Mukhopadhyay
通讯作者:
S. Mukhopadhyay
DOI:
10.1109/ijcnn.2016.7727554
发表时间:
2016
期刊:
2016 International Joint Conference on Neural Networks (IJCNN)
影响因子:
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作者:
D. Nikovski;Kiran Byadarhaly
通讯作者:
Kiran Byadarhaly
DOI:
10.1145/1840845.1840914
发表时间:
2010
期刊:
2010 ACM/IEEE International Symposium on Low-Power Electronics and Design (ISLPED)
影响因子:
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作者:
Ryan Cochran;Abdullah Nazma Nowroz;S. Reda
通讯作者:
S. Reda
DOI:
10.7873/date.2015.0639
发表时间:
2015-03
期刊:
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE)
影响因子:
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作者:
Daehyun Strobel;Florian Bache;David F. Oswald;Falk Schellenberg;C. Paar
通讯作者:
Daehyun Strobel;Florian Bache;David F. Oswald;Falk Schellenberg;C. Paar
DOI:
10.23919/date.2017.7927274
发表时间:
2017
期刊:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017
影响因子:
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作者:
S. Reda;A. Belouchrani
通讯作者:
A. Belouchrani