Nanoscratching of copper surface by CeO2
Nanoscratching of copper surface by CeO2
复制标题
CeO2对铜表面的纳米划伤
DOI：
10.1016/j.actamat.2016.11.008
复制
发表时间：
2017-02
期刊：
影响因子：
9.4
通讯作者：
Shan Zhiwei
中科院分区：
文献类型：
--
作者：
Xu Ning;Han Weizhong;Wang Yuchun;Li Ju;Shan Zhiwei
纳米CeO2浆料广泛应用于集成电路制造中的化学机械抛光。然而，材料去除和平坦化的基本过程仍然难以捉摸。通过将纳米压痕系统与自制的CeO2针尖相结合，我们定量地研究了恒载和斜坡加载模式下铜膜的纳米划痕行为。根据摩擦系数的变化，纳米划痕行为可分为三个区域。对于状态I，摩擦系数随法向载荷的增加而急剧下降，铜主要经历弹性变形。当法向载荷达到临界值时，摩擦磨损开始进入区域II，此时摩擦系数和划痕损伤都开始呈现出随法向载荷的增加而变化的弹塑性特征。在区域III中，摩擦系数达到一个稳定值，并与法向载荷无关，铜膜的变形进入稳定的弹塑性状态。区域I和区域II的摩擦系数分别可以用赫兹接触理论和经典摩擦模型来描述。详细的分析表明，当应力集中接近铜的屈服强度时，两种模型之间会发生过渡，并且可以通过调整法向力和磨料粒度参数来预测材料的去除率。
CeO2nanoparticles based slurries are widely used for chemical mechanical polishing in integrated circuit manufacturing. However, the fundamental processes of material removal and planarization remain elusive. By combining a nanoindenter system with a homemade CeO2tip, we investigated the nanoscratching behavior of copper film quantitatively under both constant load and ramp load modes. Based on the evolution of the coefficient of friction, the nanoscratching behavior can be divided into three regimes. For regime I, the coefficient of friction decreases sharply along with the increasing normal load and the copper undergoes mainly elastic deformation. The friction wear begins to enter regime II once the normal load reaches a critical value from where both the coefficient of friction and scratch damage begin to exhibit a changing elastic-plastic characteristic with the increasing of normal load. In regime III, the coefficient of friction reaches a steady value and becomes independent of the normal load and the deformation of copper film enters a steady elastic-plastic state. The coefficient of friction in regime I and II can be well modeled by Hertz contact theory and the classical friction models, respectively. Detailed analysis demonstrates the transition between the two models occurs when the stress concentration approaches the yield strength of copper and the material removal rate can be predicted by adjusting the parameter of the normal force and the abrasive particle size.
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DOI：
10.1007/978-3-540-73448-2_6
发表时间：
2007
期刊：
--
影响因子：
--
作者：
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通讯作者：
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影响因子：
3.9
作者：
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5
作者：
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通讯作者：
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影响因子：
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作者：
Liangchi Zhang;K. Mylvaganam
通讯作者：
Liangchi Zhang;K. Mylvaganam
影响因子：
5
作者：
Zhao, YW;Chang, L
通讯作者：
Chang, L