Laser-induced front side etching of CaF2 crystals with KrF excimer laser

Laser-induced front side etching of CaF2 crystals with KrF excimer laser
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使用 KrF 准分子激光器对 CaF2 晶体进行激光诱导正面蚀刻

DOI:
10.1016/j.apsusc.2012.11.067
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发表时间:
2013
影响因子:
6.7
通讯作者:
K. Zimmer
K. Zimmer
中科院分区:
材料科学1区
文献类型:
--
作者:
P. Lorenz;M. Ehrhardt;K. Zimmer

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人们对熔融石英等非晶材料的激光诱导正面蚀刻 (LIFE) 进行了多方面的研究,并且对 LIFE 工艺进行了充分优化,可以制造表面粗糙度非常低的轮廓分明的蚀刻沟槽。 LIFE 工艺是一种间接激光诱导烧蚀工艺,对于所使用的激光波长,透明基板被高吸收材料覆盖,吸收过程导致激光能量转移到基板中,最后进行基板表面的烧蚀过程。然而,像CaF2这样的晶体材料的结构对于LIFE过程来说是一个巨大的挑战。通过白光干涉仪(WLI)和扫描电子显微镜(SEM)分析了KrF准分子激光脉冲(脉冲持续时间Δtp=25ns,波长λ=248nm)蚀刻的CaF2(111)和CaF2(001)表面的性能。激光蚀刻 CaF2 表面的表面形貌取决于激光参数和晶体取向,并且经常以微裂纹和片状剥落为特征。因此,最可能的原因是激光引起的热应力或激光引起的冲击波。
The laser-induced front side etching (LIFE) of amorphous materials like fused silica was manifold studied and the LIFE process was sufficient optimized for the fabrication of well-defined etching trenches with a very low surface roughness. The LIFE process is an indirect laser-induced ablation process, the – for the used laser wavelength – transparent substrate was covered by a highly absorbing material and the absorbing process causes a transfer of the laser energy into the substrate and, finally, to an ablation process of the substrate surface. However, the structuring of crystalline materials like CaF2is a great challenge for the LIFE process. The properties of CaF2(111) and CaF2(001) surfaces etched by KrF excimer laser pulses (pulse duration Δtp=25ns, wavelength λ=248nm) were analysed by white light interferometry (WLI) as well as scanning electron microscopy (SEM). The surface morphologies of laser etched CaF2surfaces depend on the laser parameters and on the crystal orientation and are frequently characterized by microcracks and flake spallation. The most probable reasons therefore are laser-induced thermal stress or laser-induced shock waves.
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