The evolution of hardness in Cu-W alloy thin films
The evolution of hardness in Cu-W alloy thin films
复制标题
Cu-W合金薄膜的硬度演变
DOI：
10.1016/j.msea.2018.05.035
复制
发表时间：
2018-06
期刊：
影响因子：
6.4
通讯作者：
Zhou Lingping
中科院分区：
文献类型：
--
作者：
Xie Tianle;Zhu Jiajun;Fu Licai;Zhang Ruiling;Li Na;Yang Mengzhao;Wang Jiale;Qin Wen;Yang Wulin;Li Deyi;Zhou Lingping
A series of Cu-W films with the W content higher than 17.2 at% were prepared by magnetron sputtering focused co-deposition technology. The micro-structures and nanoidentation hardness of the films were investigated. Except for the fcc, amorphous and bcc phases, a novel multilayered structure has been observed at the range of about 17.2–90 at% W. Within the multilayered structure, the high-density interfaces can inhibit the motion of dislocations, which resulted in the hardness at least 2 GPa higher than that of the mixing rule. Depending on different microstructures, the hardness curve of the Cu-W films can be divided into three regions instead of the linear increase with the W content. From 17.2–40 at% W, the hardness increased slowly due to lots of amorphous phase. Within 40–65 at% W, the hardness increased linearly, which was caused by the gradually obvious multilayered structure and decreasing amorphous content. Above 65 at% W, single-phase body-centered cubic (bcc) films were observed. In this region, the upward trend of hardness slowed down due to the porous columnar structure and gradually disappeared multilayered structure.
登录
查看更多内容
影响因子：
1.5
作者：
Ruifeng Zhang;Zheng-cao Li;Bai-xin Liu
通讯作者：
Ruifeng Zhang;Zheng-cao Li;Bai-xin Liu
定制具有增强硬度和可调模量的纳米结构铜/铬多层薄膜
DOI：
10.1016/j.msea.2012.02.061
发表时间：
2012-05
影响因子：
6.4
作者：
Zhang, J. Y.;Niu, J. J.;Zhang, X.;Zhang, P.;Liu, G.;Zhang, G. J.;Sun, J.
通讯作者：
Sun, J.
影响因子：
2.1
作者：
M. Monclús;M. Karlík;M. Callisti;E. Frutos;J. Llorca;T. Polcar;J. Molina-Aldareguia
通讯作者：
M. Monclús;M. Karlík;M. Callisti;E. Frutos;J. Llorca;T. Polcar;J. Molina-Aldareguia
影响因子：
9.4
作者：
F.T.N. Vüllers;R. Spolenak
通讯作者：
F.T.N. Vüllers;R. Spolenak
影响因子：
9.4
作者：
Misra, A;Hirth, JP;Hoagland, RG
通讯作者：
Hoagland, RG