High-gain low-cost broadband 60 GHz differential integrated patch array antennas with wire-bonding packaging and on-board compensation network
High-gain low-cost broadband 60 GHz differential integrated patch array antennas with wire-bonding packaging and on-board compensation network
复制标题
具有引线接合封装和板载补偿网络的高增益低成本宽带 60 GHz 差分集成贴片阵列天线
DOI：
10.1049/iet-map.2016.0430
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发表时间：
2017-01
影响因子：
1.7
通讯作者：
Cui Tie Jun
中科院分区：
文献类型：
--
作者：
Zhang Tao;Li Lianming;Zhao Dixian;Xia Haiyang;Chai Yuan;Guo Jian;Qian Chen;Zheng Fu-Chun;Cui Tie Jun
在Rogers 5880基片上设计并实现了两种高增益宽带60 GHz无空气腔和有空气腔的集成平面贴片阵列天线。差分天线结构用于改善毫米波频率下的信号完整性。天线与键合线共同设计，使用无源网络补偿其寄生效应。该天线具有方向图对称、带宽宽、插入损耗低等优点。在测量中，基于差分传输线的去嵌入结构被开发在硅上，模仿真实的芯片封装环境，并为天线提供可靠的终端。测量的分数带宽（|
S
11
| <;-10dB）分别为13.8%和26.2%，包括波导-微带线过渡和分支线巴伦的影响。两个天线的测量增益约为12 dBi。在对回波损耗进行去嵌入后，在61 GHz时，键合线补偿网络的插入损耗仅为0.07dB。
Two high-gain broadband 60GHz integrated planar patch array antennas, without and with air cavity, are designed and implemented on Rogers 5880 substrate. The differential antenna structure is used to improve the signal integrity at millimetre-wave frequencies. The antennas are co-designed with bonding wires of which the parasitic effect is compensated using a passive network. The proposed antennas have the advantages of symmetrical radiation pattern, wide bandwidth and low insertion loss. In the measurement, a differential transmission line based de-embedding structure is developed on silicon, mimicking the real chip packaging environment and providing reliable terminations for antennas. The measured fractional bandwidths (|
S
11
| <; -10dB) are 13.8 and 26.2%, respectively, for the two structures without and with air cavity, including the effect of a waveguide-to-microstrip line transition and a branch-line balun. Both antennas have measured gain of about 12 dBi. After de-embedding the return loss, the measured insertion loss of the bond wire compensation network is only 0.07dB at 61GHz.
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DOI：
10.1109/mwsym.2013.6697506
发表时间：
2013-06
期刊：
2013 IEEE MTT-S International Microwave Symposium Digest (MTT)
影响因子：
--
作者：
B. Ku;P. Schmalenberg;Sang Young Kim;Choul‐Young Kim;O. Inac;Jae S. Lee;K. Shiozaki;Gabriel M. Rebeiz
通讯作者：
B. Ku;P. Schmalenberg;Sang Young Kim;Choul‐Young Kim;O. Inac;Jae S. Lee;K. Shiozaki;Gabriel M. Rebeiz
影响因子：
5.7
作者：
Liao, Shaowei;Wu, Peng;Xue, Quan
通讯作者：
Xue, Quan
影响因子：
5.4
作者：
A. Natarajan;S. Reynolds;Ming-Da Tsai;S. Nicolson;J. Zhan;D. Kam;Duixian Liu;Y. Huang;A. Valdes-Ga
通讯作者：
A. Natarajan;S. Reynolds;Ming-Da Tsai;S. Nicolson;J. Zhan;D. Kam;Duixian Liu;Y. Huang;A. Valdes-Ga
DOI：
10.1109/wamicon.2016.7483822
发表时间：
2016-04
期刊：
2016 IEEE 17th Annual Wireless and Microwave Technology Conference (WAMICON)
影响因子：
--
作者：
Zhang Tao;Lianming Li;Hai-yang Xia;Xujun Ma;Dixian Zhao;Jun-hai Cui
通讯作者：
Zhang Tao;Lianming Li;Hai-yang Xia;Xujun Ma;Dixian Zhao;Jun-hai Cui
影响因子：
4.2
作者：
A. Bisognin;D. Titz;F. Ferrero;G. Jacquemod;R. Pilard;F. Gianesello;D. Gloria;P. Brachat;C. Laporte;H. Ezzeddine;C. Luxey
通讯作者：
A. Bisognin;D. Titz;F. Ferrero;G. Jacquemod;R. Pilard;F. Gianesello;D. Gloria;P. Brachat;C. Laporte;H. Ezzeddine;C. Luxey