Influence of bias voltage and oxygen flow rate on morphology and crystallographic properties of gas flow sputtered zirconia coatings
Influence of bias voltage and oxygen flow rate on morphology and crystallographic properties of gas flow sputtered zirconia coatings
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偏压和氧气流量对气流溅射氧化锆涂层形貌和晶体性能的影响
DOI：
10.1016/j.surfcoat.2015.06.002
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发表时间：
2015
影响因子：
5.4
通讯作者：
J. Rösler
中科院分区：
文献类型：
--
作者：
N. Rösemann;K. Ortner;J. Petersen;T. Schadow;M. Bäker;G. Bräuer;J. Rösler
这项工作的目的是从根本上了解偏压和氧气流量对气流溅射 (GFS) 氧化钇稳定氧化锆涂层的微观结构和晶体学特性的影响。在给定的 500 °C 基底温度下，完全氧化钇稳定氧化锆 (FYSZ) 涂层 (10–30 µm) 沉积在 FeCrAl 合金上。氧气流量和基底偏压在很宽的范围内变化。所得的微结构是柱状的，但孔隙率和柱直径变化很大。虽然增加氧气流量通常会导致更粗的微观结构和更高的孔隙率，但由于低电压下的离子轰击，偏压似乎会增加有效表面温度，但在较高电压下会产生破坏性影响，导致随机晶粒取向和小晶粒尺寸。热循环实验在 100°C 至 1050°C 之间进行。尽管没有观察到大规模剥落，但前柱状涂层由于烧结而降解，导致前单柱之间出现烧结颈并减少柱内孔隙率。然而，高氧气流量和适度的偏压由于较粗的形态而增加了烧结阻力。
The aim of this work is to gain a fundamental understanding of the influence of bias voltage and oxygen flow rate on the resulting microstructure and crystallographic properties of gas flow sputtered (GFS) yttria stabilized zirconia coatings.At given substrate temperature of 500 °C fully yttria stabilized zirconia (FYSZ) coatings (10–30 μm) were deposited on a FeCrAl-alloy. The oxygen flow rate and the substrate bias voltage were varied over a wide range.The resulting microstructures were columnar, but varied widely in porosity and column diameter. While increased oxygen flow rate generally results in coarser microstructures with higher porosity, bias voltage seems to increase the effective surface temperature due to ion bombardment at low voltage, but has a destructive effect at higher voltages leading to randomized grain orientations and small grain sizes.Thermal cycling experiments were conducted between 100 °C and 1050 °C. Although no large scale spallation was observed, the former columnar coating degraded due to sintering, resulting in sinter necks between former single columns and diminished intra-columnar porosity. However, high oxygen flow rate and moderate bias increase the resistance to sintering due to coarser morphologies.
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DOI：
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