Chemical mechanical polishing of the narrow channel of a channel-cut crystal
Chemical mechanical polishing of the narrow channel of a channel-cut crystal
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通道切割晶体窄通道的化学机械抛光
DOI：
10.1007/s00170-020-05443-2
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发表时间：
2020-05
影响因子：
3.4
通讯作者：
Wang Zhanshan
中科院分区：
文献类型：
--
作者：
Wang Kun;Li Wenhao;Qu Qintao;Wang Zhanshan
作为同步辐射源的光束线站点的必需梁拆分组件，通道切割晶体可改善从同步辐射源发出的X射线束的反射率，准确和稳定性。然而，
As an essential beam-splitting component in the beamline station of synchrotron radiation sources, the channel-cut crystal serves to improve reflectivity, collimation, and stability of the X-ray beam emitted from the synchrotron radiation source. However, a major limitation to the implementation of the channel-cut crystal is polishing its narrow channel. To resolve this problem, a novel chemical mechanical polishing motion pattern is proposed. In addition, a relative motion model between the workpiece and the polishing plate is established, the equation of the trajectory of the abrasives relative to the workpiece is derived, the effects of multiple factors such as motion cycle ratio between the workpiece and the polishing plate are analyzed, and eccentric radius on the relative motion trajectory is analyzed too. Furthermore, by identifying the effects of the polishing trajectory, the polishing solution concentration and polishing pressure on the polishing results were explored, and the mirror polishing of the inner surface of the narrow channel of the channel-cut crystal is realized successfully. The proposed motion patterns of CMP can be applied to polish narrow structures of hard and brittle material (e.g., silicon, glass).
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