Assessing the Quality of Oxygen Plasma Focused Ion Beam (O-PFIB) Etching on Polypropylene Surfaces Using Secondary Electron Hyperspectral Imaging.

Assessing the Quality of Oxygen Plasma Focused Ion Beam (O-PFIB) Etching on Polypropylene Surfaces Using Secondary Electron Hyperspectral Imaging.
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DOI:
10.3390/polym15153247
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发表时间:
2023-07-30
期刊:
影响因子:
5
通讯作者:
de Marco A
de Marco A
中科院分区:
工程技术3区
文献类型:
--
作者:
Farr NTH;Pasniewski M;de Marco A

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聚焦离子束扫描电子显微镜(FIB-SEM)系统的发展为聚合物的加工和表征提供了显著的进步。离子样品相互作用的基本理解仍然是失踪,尽管纤维束扫描电镜常规应用于聚合物的微观结构分析。本研究应用二次电子高光谱成像技术来揭示氧和氙等离子体FIB在聚合物(在这种情况下,聚丙烯)表面上的相互作用。二次电子高光谱成像(SEHI)是一种位于SEM室内的技术,具有高空间分辨率的多尺度表面灵敏度,并且能够使用低束能量识别碳键,而无需超高真空(UHV)。SEHI通过使用通过透镜检测器(TLD)来提供低初级电子束能量和电流的低通SE收集而成为可能。绘制从不同能量范围在相同感兴趣区域上采集的SE图像以产生SE谱。本研究中提供的数据证明了SEHI能够成为PFIB蚀刻后聚合物表面表征的有价值工具,从而可以深入了解定制聚合物加工FIB参数和SEHI用于原位监测系列FIB聚合物表面的能力。
The development of Focused Ion Beam–Scanning Electron Microscopy (FIB-SEM) systems has provided significant advances in the processing and characterization of polymers. A fundamental understanding of ion–sample interactions is still missing despite FIB-SEM being routinely applied in microstructural analyses of polymers. This study applies Secondary Electron Hyperspectral Imaging to reveal oxygen and xenon plasma FIB interactions on the surface of a polymer (in this instance, polypropylene). Secondary Electron Hyperspectral Imaging (SEHI) is a technique housed within the SEM chamber that exhibits multiscale surface sensitivity with a high spatial resolution and the ability to identify carbon bonding present using low beam energies without requiring an Ultra High Vacuum (UHV). SEHI is made possible through the use of through-the-lens detectors (TLDs) to provide a low-pass SE collection of low primary electron beam energies and currents. SE images acquired over the same region of interest from different energy ranges are plotted to produce an SE spectrum. The data provided in this study provide evidence of SEHI’s ability to be a valuable tool in the characterization of polymer surfaces post-PFIB etching, allowing for insights into both tailoring polymer processing FIB parameters and SEHI’s ability to be used to monitor serial FIB polymer surfaces in situ.
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