Industry/University Cooperative Research Project: Modeling of Extrusion Cooking Process for Soy Flour Doughs

本研究的目的是建立豆粉和其他食品面团挤压烹饪过程的三维模型。该模型将预测挤出物温度、质量流量、停留时间分布和挤出机中的热历史，所有这些都是影响挤出物质地的因素，作为螺杆和模具设计、螺杆转速和筒体温度曲线的函数。本研究建立的模型将有助于挤出工艺的优化和挤出机的放大。

The goal of this research is to develop a three-dimensional model of the extrusion cooking process for soy flour and other food doughs. This model will predict extrudate temperature, mass flow rate, residence time distribution, and thermal history in the extruder, all of which are factors affecting extrudate texture as a function of screw and die design, screw RPM's, and barrel temperature profile. The model to be created by this research will be helpful for extrusion process optimization and extruder scale-up.