Development of a System for In-Process Characterization of Properties and Forming Characteristics of Copper Alloy Strip

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This proposal is to develop and demonstrate a system for in- process characterization of a signature representing the properties and thus the stamping and forming characteristics of copper alloy strip. The development will be accomplished by combined application of three techniques (acoustic, eddy current, and X-ray diffraction) for non-intrusive characterization of polycrystalline metal alloys. These non-contact techniques were specifically selected for their complimentary nature and real time capabilities. Selection was the result of a prior NSF grant. Each of the techniques selected for the combined measurements is sensitive to different sets of characteristics and thus will provide a sensitive system for measuring interdependent changes in these characteristics. The three techniques will accomplish interrogation of different volumes of the subject material due to the various depth of probing offered by the teamed system. An experimental approach will be employed to develop and demonstrate the system. Relations will be developed relating the teamed signature to the mechanical properties and stamping and forming characteristics of the copper alloy strip. Electronic copper alloy strip was selected as the class of materials and the fabrication of switches and contacts as the forming process on which to focus. The methodology developed by this work for combining various measurements should have generic value and permit application to other materials and processes. The combined application of the three measurement techniques is novel. This research should lead to in-process measurement of properties and fabrication characteristics of wrought metallic alloys which should result in significant improvement in productivity and quality.