PYIA: Computer Modeling of Microstrip Interconnects in mm-waves
PYIA: Computer Modeling of Microstrip Interconnects in mm-waves
批准号:
8657951
负责人:
Linda Katehi
金额:
$30.45万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1987
资助国家:
美国
项目状态:
已结题
起止时间:
1987-06-15 至 1993-05-31
中文摘要
该PI是总统青年研究员(PYI),并描述她的研究如下:计算机辅助设计(CAD)技术在毫米波单片集成电路的设计和性能中起着重要作用。尽管有这种需要,但现有的CAD功能都不能很好地用于高频的设计。该项目旨在开发精确的CAD算法,用于表征毫米波范围内的屏蔽微带互连,如过孔。求解上述问题的方法是积分方程的有限元法。与其他现有方法相比,这种方法的优点是能够解决水平和垂直不连续的问题。上述分析技术可以为任何微带互连提供严格的现场解决方案,其中包含尽可能多的涉及物理因素,包括:表面波,辐射,介电损耗和n=电路元件之间的相互作用。计算机辅助设计(CAD)技术在毫米波单片集成电路的设计和性能中起着重要的作用。尽管有这种需要,但现有的CAD功能都不能很好地用于高频的设计。本项目旨在开发精确的CAD算法来表征毫米波范围内屏蔽微带互连。
英文摘要
The PI is a Presidential Young Investigator (PYI) and describes her research as follows: Computer-aided-design (CAD) techniques play a major role in the design and performance of Millimeter-wave Monolithic Integrated Circuits. Despite the need, none of the existing CAD capabilities can really work well for designs intended for very high frequencies. This project aims at developing accurate CAD algorithms for characterizing shielded-microstrip interconnects such as via-holes in the mm-wave range. The method to be applied for the solution of the above problem is a Finite Element Method for Integral Equations. The advantage of this method over other existing ones is its ability to solve both horizontal and vertical discontinuities. The above analytical technique can provide a rigorous field solution for any microstrip interconnect with as many of the involved physical factors incorporated and possible including: surface waves, radiation, dielectric losses and n=mutual interactions between circuit elements. Computer-aided-design (CAD) techniques play a major role in the design and performance of Millimeter-wave Monolithic Integrated Circuits. Despite the need, none of the existing CAD capabilities can really work well for designs intended for very high frequencies. This project aims at developing accurate CAD algorithms for characterizing shielded-microstrip interconnects in the mm-wave range.
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