Dispersive Models For High Frequency Interconnects and Microstrip Junctions

随着微波和毫米波集成电路的日益复杂，对邻近耦合无源元件和微带结的理解和建模对准确预测电路性能起着重要作用。在本文提出的研究中，一种基于数值方法求解积分方程组的动态色散严格方法将应用于集成电路结构中经常遇到的一类重要的微带结和跃迁。该研究还将对互连问题进行理论和实验研究，重点是微波和毫米波集成电路的应用。它将首先关注微带互连；在基板-上层配置中的多级共线和横向耦合互连的建模和实验，目的是优化从一个电路级到另一个电路级的功率耦合。随后，将研究多电平交叉互连，目的是最小化VLSI应用中的串扰，或最大化某些集成电路微带天线阵列应用中的功率耦合。这随后将被扩展以处理共线、横向以及交叉配置中的多个或多个多电平微带互连。介质波导结构的光学互连问题也将以与微波和毫米波电路类似的方式解决。

With the increasing complexity of microwave and millimeter wave integrated circuits, the understanding and modeling of proximity coupled passive components and microstrip junctions play an important role in accurately predicting the circuit performance. In the research proposed in this document, a dynamic dispersive rigorous approach based on solving integral equations with numerical methods will be applied to a class of important microstrip junctions and transitions frequently encountered in integrated circuit structures. The research will also investigate theoretically and experimentally the issue of interconnects with emphasis on microwave and millimeter wave integrated circuit applications. It will focus initially on microstrip interconnects; the modelling and experimentation of multilevel collinear and transversely coupled interconnects in a substrate-super-strate configuration with the intent of optimizing the power coupled from one circuit level to another. Subsequently, multi- level cross-over interconnects will be studied with the intent of minimizing cross-talk as for VLSI applications, or maximizing coupling of power for certain integrated circuit microstrip antenna array applications. This will be subsequently expanded to deal with multiple or arrays of multi-level microstrip inter-connects in collinear, transverse as well as cross-over configurations. The issue of optical interconnects will also be addressed for dielectric waveguiding structures in a similar way as for microwave and millimeter wave circuits.