Research Initiation: Adsorption Kinetics of Organic Compounds at a Metal/Electrolyte Interface

这是对铜-硫脲体系的研究。硫脲的加入对铜的电沉积和电溶解均有影响。除了探索使用交流阻抗作为定量方法来测量硫脲在铜上的吸附动力学之外，本研究还使用了标准的电化学技术，如伏安法。在所有实验中都使用旋转圆盘电极来区分动力学效应和传质效应。傅里叶变换红外反射光谱提供了电极-溶液界面物种的原位表征。结合实验研究，对交流阻抗在吸附动力学和涉及吸附的复杂电化学过程中的应用进行了数学分析。许多电化学过程依赖于有机分子在电极表面的吸附能力。这是对吸附动力学的研究，旨在提高对吸附机理和吸附对工业上重要的电化学过程的影响的理解。选择硫脲作为模型化合物是因为它既可以用来抑制铜的腐蚀，也可以用来促进铜的电镀。

This is a study of the copper-thiourea system. Both electrodeposition and electrodissolution of copper are influenced by the addition of thiourea. This investigation uses standard electrochemical techniques such as voltammetry in addition to exploring the use of alternating- current impedance as a quantitative method to measure the adsorption kinetics of thiourea on copper. A rotating disk electrode is used in all experiments to distinguish between kinetic and mass-transfer effects. Fourier-transform infrared reflection spectroscopy provides an in situ characterization of species at the electrode-solution interphase. Mathematical analysis of the application of AC impedance to adsorption kinetics and complicated electrochemical processes involving adsorption is done concurrently with the experimental studies. Many electrochemical processes depend on the ability of organic molecules to adsorb on the electrode surface. This is a study of adsorption kinetics designed to improve understanding of adsorption mechanisms and the effects of adsorption on industrially important electrochemical processes. Thiourea is chosen as the model compound because it is used both to inhibit corrosion of copper and to enhance electroplating of copper.