Research Initiation: Adsorption Kinetics of Organic Compounds at a Metal/Electrolyte Interface

本文研究了铜-硫脲体系。 两种电沉积 和铜的电溶解的影响， 硫脲 这项研究使用标准的电化学技术 例如伏安法，除了探索使用交替- 电流阻抗作为定量方法来测量吸附 硫脲对铜的吸附动力学 旋转盘电极用于 所有区分动力学和传质的实验 方面的影响. 傅里叶变换红外反射光谱提供了 电极溶液中物质的原位表征 间期。 交流阻抗应用的数学分析 吸附动力学和复杂的电化学过程 涉及吸附是同时进行的实验 问题研究 许多电化学过程依赖于有机物的能力， 分子吸附在电极表面上。 这是研究 吸附动力学，旨在提高对吸附的理解 吸附的机理和影响，对工业上重要的 电化学过程 选择噻托溴铵作为模型化合物 因为它既用于抑制铜的腐蚀， 电镀铜。

This is a study of the copper-thiourea system. Both electrodeposition and electrodissolution of copper are influenced by the addition of thiourea. This investigation uses standard electrochemical techniques such as voltammetry in addition to exploring the use of alternating- current impedance as a quantitative method to measure the adsorption kinetics of thiourea on copper. A rotating disk electrode is used in all experiments to distinguish between kinetic and mass-transfer effects. Fourier-transform infrared reflection spectroscopy provides an in situ characterization of species at the electrode-solution interphase. Mathematical analysis of the application of AC impedance to adsorption kinetics and complicated electrochemical processes involving adsorption is done concurrently with the experimental studies. Many electrochemical processes depend on the ability of organic molecules to adsorb on the electrode surface. This is a study of adsorption kinetics designed to improve understanding of adsorption mechanisms and the effects of adsorption on industrially important electrochemical processes. Thiourea is chosen as the model compound because it is used both to inhibit corrosion of copper and to enhance electroplating of copper.