Electrodeposition of Metal Matrix Composite Films

金属基复合薄膜的电沉积

• 批准号: 9971508
• 负责人: Jan Talbot
• 金额: $ 13.97万
• 依托单位: University of California-San Diego
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-07-01 至 2002-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9971508&HistoricalAwards=false
• 关键词: Electrodeposition; Metal; Matrix; Composite; Films

AbstractProposal Title: Electrodeposition of Metal Matrix Composite Films Proposal Number: CTS-9971508Principal Investigator: Jan TalbotInstitution: University of California San DiegoElectrocodeposition is the process of particle incorporation during the electrolytic deposition of metal. This process produces composite films consisting of a metallic matrix containing a dispersion of small particles. Electrocodeposited films with micron size particles have found important applications in areas such as corrosion and wear protection, lubrication, and electrocatalysis. Although composite films are currently manufactured using this technique, the ability to define the conditions necessary to achieve a specified volume fraction of uniformly dispersed particles in the deposited film has not been established. An understanding of how the deposition rate depends on the processing conditions is essential to controlling the deposit composition and properties. The objective of the research is to improve the ability to tailor electrodeposited metal matrix composite films of both uniform and gradient particle distributions by investigating the effects of process variables on particle incorporation within the deposit. The electrocodeposition of alumina particles in a copper matrix will be systematically studied using a rotating cylinder electrode. This electrode configuration allows the effects of hydrodynamics on particle incorporation to be investigated. New materials structures of gradient composite films with a gradient in the particle concentration will be made based upon the results of the electrocodeposition study. Existing models of codeposition will be applied to the experimental data, and an improved model or correlation of electrocodeposition will be developed.

摘要提案标题： 电沉积金属基复合材料薄膜提案编号：CTS-9971508主要研究者：Jan Talbot机构：加州大学圣地亚哥分校电共沉积是金属电解沉积过程中颗粒掺入的过程。 该工艺生产由含有小颗粒分散体的金属基质组成的复合膜。 具有微米尺寸颗粒的电共沉积膜在诸如腐蚀和磨损保护、润滑和电催化等领域中具有重要的应用。 尽管目前使用该技术制造复合膜，但尚未建立限定在沉积膜中实现均匀分散颗粒的特定体积分数所需的条件的能力。 了解沉积速率如何取决于处理条件对于控制存款成分和性质是必不可少的。 本研究的目的是通过研究工艺参数对存款内颗粒掺入的影响，提高定制均匀和梯度颗粒分布的电沉积金属基复合材料膜的能力。 采用旋转圆柱电极系统地研究了氧化铝颗粒在铜基体中的电共沉积。 这种电极配置允许流体动力学对颗粒掺入的影响进行研究。 基于电共沉积的研究结果，将制备出具有颗粒浓度梯度的梯度复合膜的新材料结构。 现有的共沉积模型将应用于实验数据，并将开发一个改进的模型或电共沉积的相关性。