Micromechanical Component Production VIA X-Ray Lithography and Precision Metal Plating

微机械元件生产 VIA X 射线光刻和精密金属电镀

• 批准号: 8815285
• 负责人: Henry Guckel
• 金额: $ 60.49万
• 依托单位: University of Wisconsin-Madison
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1988
• 资助国家: 美国
• 起止时间: 1988-08-15 至 1992-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=8815285&HistoricalAwards=false
• 关键词: Micromechanical; Component; Production; VIA; Ray

An interdisciplinary research team consisting of electrical and mechanical engineers will carry out fundamental research directed toward an improved understanding of processing technology for the fabrication of microelectromechanical devices. This research will use synchrotron based x-ray lithography in connection with 25 micron PMMA (poly methyl methacrylate) photoresist layers and fine-grained polysilicon mask blanks with optically defined absorber patterns made from one micron thick electroplated gold layers. The thick photoresist will be exposed on Aladdin, the Wisconsin synchrotron, and subsequent developing will produce vertical flank PMMA profiles with one micron minimum feature sizes. These structures will then be electroplated to provide micromechanical devices made from the materials used to electroplate the silicon. Additionally, research in plating will be aimed at creating deposits with repeatable and controlled mechanical properties and will focus on nickel, gold, cobalt-nickel, and silver-palladium alloys. The nickel- cobalt alloys are intended for bearing surfaces in microelectro- mechanical devices. The silver alloys address contact welding problems in microswitch applications. The proposed process is fundamental to micromechanics and, in particular, lends itself to actuator construction such as miniature gears and acceleration driven switches, in addition to numerous other potential applications.

一个由电气和机械工程师组成的跨学科研究小组将开展基础研究，旨在提高对制造微电子机械设备的加工技术的理解。这项研究将使用基于同步加速器的X射线光刻技术，结合25微米PMMA(聚甲基丙烯酸甲酯)光致抗蚀剂层和具有由1微米厚的电镀金层制成的光学定义的吸收图案的精细多晶硅掩模空白。厚厚的光刻胶将被曝光在威斯康星州同步加速器Aladdin上，随后的显影将产生最小特征尺寸为1微米的垂直侧面PMMA轮廓。然后，这些结构将被电镀，以提供由用于电镀硅的材料制成的微机械设备。此外，电镀研究的目标将是创造具有可重复和可控制的机械性能的镀层，并将重点放在镍、金、钴镍和银钯合金上。镍钴合金用于微电子机械设备的轴承表面。银合金解决了微开关应用中的接触焊接问题。所提出的工艺是微观力学的基础，尤其适合于执行器结构，例如微型齿轮和加速度驱动开关，以及许多其他潜在的应用。