Heat Transfer Analysis of Transient Thermal Processing of Multilayer Thin Film Structures

瞬态热处理是多层膜制备的关键步骤 用于电子器件的薄膜制造。主要障碍 目前的热处理技术是材料缺陷， 例如翘曲和滑动，这是由热应力引起的 薄膜结构中的温度梯度。 期间 建议的调查，将开发一种数值技术 预测多层薄膜中的温度分布 在热处理过程中始终保持结构。 该技术 将模拟具有可变光学特性的薄膜的复杂几何形状， 和热性能，将允许相变，并将 包括固定和可变热源。 参数研究 以下的发展将集中在两个新兴的瞬态 热加工技术，区域熔融再结晶，热处理工艺，热处理技术 (ZMR)和快速热退火（RTA），其中有立即 需要热分析。 这项技术将被测试 在薄膜的“大尺度”模型上进行实验 结构

Transient thermal processing is an essential step in multilayer thin film fabrication for electronic devices. Major hurdles in current thermal processing techniques are the material defects, such as warpage and slip, caused by thermal stresses due to temperature gradients in the thin-film structures. During the proposed investigation, a numerical technique will be developed to predict the temperature distribution in a multilayer thin film structure at all times during thermal processing. The technique will simulate complex geometries of films with variable optical and thermal properties, will allow for phase change, and will include stationary and variable heat sources. Parametric study following the development will focus on two emerging transient thermal processing technologies, Zone Melting Recrystallization (ZMR) and Rapid Thermal Annealing (RTA), where there is immediate need for thermal analysis. The technique will be tested experimentally on "large scale" models of the thin film structure.