Photolithography: A Novel Approach to Controlled Study of Crack Healing and Pore Morphology Evolution

本研究是一项为期三年的研究，利用工程缺陷在控制错取向掺杂和未掺杂的蓝宝石双晶体中进行裂纹愈合和孔隙形态演变。这些缺陷是由光刻技术产生的，这使得首次可以详细和独立地分析晶界取向错误（结构）和化学对高温裂纹愈合和孔隙形态演变过程的影响（发生在陶瓷和多层层压板的烧结和扩散连接中）。这些过程的详细表征正在使用光学显微镜、扫描电子显微镜和扫描透射电子显微镜进行微化学分析。

This research consists of a three year study of crack healing and pore morphology evolution using engineered flaws in controlled-misorientation doped and undoped sapphire bicrystals. The flaws are created by photolithographic techniques which allow, for the first time, detailed and independent analyses of the effects of grain boundary misorientation (structure) and chemistry on high temperature crack healing and pore morphology evolution processes (which occur in sintering and diffusion bonding of ceramics and multilayer laminates). Detailed characterization of these processes is being done using optical microscopy, scanning electron microscopy, and scanning transmission electron microscopy with microchemical analysis.