Flow and Transport in Systems with Shape Change: Mass Transfer in Electrochemical Systems

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This project focuses on modelling the moving boundary in electrodeposition and electroetching processes. Models successfully predicting shape change effects in diffusion and migration dominated cases will be extended to include cases where convective transport is important, such as electrochemical deposition of magnetic material onto a rotating fixed-disk leaf. Model development will be correlated with experimental studies. A modified Galerkin finite element technique with a moving grid will be developed to solve the time dependent model with convection. Many engineering applications in coating technology, crystal growth, selective epitaxy, electrochemical platting, machining, and corrosion involve a free and/or moving interfacial region. Often the shape or evolution of the interface is of primary importance in processing, as in electromachining and electroplating. This project singles out electrodeposition and etching systems, which are of great importance in the electronics industry. Insights gleaned from numerical simulation and physical experiments on prototype systems will lead to increased fundamental understanding of these processes as well as insight into scale-up and operation of new generation techniques currently being developed. After minor adaptation the numerical techniques being developed will be applicable to the other moving boundary/interface systems listed above.