Bulk Silicon Technologies for Microelectromechanical Systems

本研究将探讨使用单面散装- 硅工艺技术的实现 微机电系统（MEMS）。 努力 基础材料表征，发展 新的微结构形成技术， 通用建模与仿真开发 MEMS的能力。 研究 结果将应用于两个和 三维设备，包括静电 驱动线性微电机，横向驱动谐振 微结构和微型阀。 一个设备， 被认为是一个完全集成的扫描热 轮廓仪（STP）使用横向驱动 由体硅制造的谐振结构。 的 STP将集成多晶硅金属 热电偶温度测量，亚微米 硅尖支撑热电偶，静电 驱动机构和芯片级封装， 堆叠多个硅级别，以保护STP免受 微粒和物理损伤。 技术 这项研究的结果应该补充表面 微机械加工技术扩展MEMS领域 实现新的结构。

This research will explore the use of single-sided bulk- silicon process technology for the realization of microelectromechanical systems (MEMS). Efforts on fundamental materials characterization, the development of new microstructure formation techniques, and the development of generic modeling and simulation capabilities for MEMS will be conducted. Research results will be applied in the fabrication of two- and three-dimensional devices, including electrostatically driven linear micromotors, laterally driven resonant microstructures, and microvalves. One device that will be considered is a fully integrated scanning thermal profilometer (STP) that operates using laterally driven resonant structures fabricated from bulk silicon. The STP will incorporate an integrated polysilicon metal thermocouple for temperature measurement, a submicron silicon tip supporting the thermocouple, electrostatic drive mechanisms, and a chip-level package realized by stacking multiple silicon levels to protect the STP from particulates and physical damage. The technology resulting from this research should complement surface micromachining techniques to extend the field of MEMS and realize new structures.