NSF/DARPA Agreement for Use of DARPA VLSI Implementation

NSF/DARPA 使用 DARPA VLSI 实施协议

• 批准号: 9015601
• 负责人: John Toole
• 金额: $ 206.16万
• 依托单位: Defense Advanced Research Projects Agency
• 依托单位国家: 美国
• 项目类别: Contract Interagency Agreement
• 财政年份: 1990
• 资助国家: 美国
• 起止时间: 1990-10-01 至 1993-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9015601&HistoricalAwards=false
• 关键词: NSF; DARPA; Agreement; Use; VLSI

A 1986 Memorandum of Understanding (MOU) between the National Science Foundation (NSF) and the Defense Advanced Research Projects Agency (DARPA) established a three-year joint program supporting VLSI (Very Large Scale Integration fabrication by MOSIS (Metal Oxide Semiconductor Implementation Service) for qualifying universities. This is a three-year continuation to that agreement, commencing October 1, 1989. This continuation of the MOU expands the original program to accelerate critical capabilities for Microsystems Design and Prototyping in U.S. universities. This includes expanding the original services and technologies available to universities authorized to use MOSIS as they become generally available (e.g. semi-custom and gallium arsenide chip fabrication); stressing VLSI education, especially undergraduate education needed for designing future electronic systems; exploring new fabrication services designed specifically for the research and education community's desire for cost effective experimentation of state-of-the-art technologies (e.g. design of advanced sensor and micromechanical devices); and rapid prototyping methodologies, tools and services needed for complete systems. The program has been widely acclaimed by both universities and industry as essential to the U.S. research and education effort, and important in the national effort to improve U.S. competitiveness. As of June 1, 1990, over one hundred forty (140) universities are authorized to use MOSIS for VLSI educational purposes and over 5500 students are enrolled in university VLSI Design classes. This has provided a valuable cost effective educational tool for teaching VLSI, as well as resulted in a sound human resource base that has significantly contributed to important research successes supported by both the NSF and DoD.

1986年签署的谅解备忘录（MOU） 科学基金会（NSF）和国防高级研究项目 美国国防部高级研究计划局（DARPA）建立了一个为期三年的联合计划， 超大规模集成电路（由MOSIS制造的超大规模集成电路（金属 Oxide Semiconductor Implementation Service）进行资格认证 高校 这是该协议的三年延续， 从1989年10月1日开始 这份谅解备忘录的延续扩大了原有的计划， 加速微系统设计的关键能力， 原型在美国大学。 这包括扩大 为大学提供的原创服务和技术 授权使用MOSIS，因为它们变得普遍可用（例如， 半定制和砷化镓芯片制造）;强调超大规模集成电路 教育，特别是设计所需的本科教育 未来电子系统;探索新的制造服务 专为研究和教育界的 对最先进的成本效益实验的需求 技术（如先进传感器和微机械设计） 设备）;以及快速原型制作方法、工具和服务 需要完整的系统。 该计划得到了两所大学的广泛好评， 工业对美国的研究和教育工作至关重要， 在改善美国经济的国家努力中也很重要 竞争力 截至1990年6月1日，超过一百四十（140） 大学被授权使用MOSIS进行VLSI教育 超过5500名学生就读于大学VLSI 设计课。 这提供了一个宝贵的成本效益 一种用于教授VLSI的教育工具，并产生了一种声音 这一人力资源基础大大促进了 由NSF和DoD支持的研究成果。