Industry Internship: Experimental and Finite Element Investigation of Thermally Induced Printed Wiring Board Warpage

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This research is directed at the warping of printed wiring boards, an increasingly detrimental factor in the assembly of fine pitch components and connectors. The research will determine the controlling factors that create the warpage condition, evaluate the influence of each factor, and determine which parameters can be controlled or eliminated in order to reduce the degree of stress related circuit card warpage. Both experimental and numerical techniques will be used for this evaluation.