Industry Internship: Experimental and Finite Element Investigation of Thermally Induced Printed Wiring Board Warpage

行业实习：热致印刷线路板翘曲的实验和有限元研究

• 批准号: 9015650
• 负责人: I. Charles Ume
• 金额: $ 2.25万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1990
• 资助国家: 美国
• 起止时间: 1990-07-01 至 1991-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9015650&HistoricalAwards=false
• 关键词: Industry; Internship; Experimental; Finite; Element

This research is directed at the warping of printed wiring boards, an increasingly detrimental factor in the assembly of fine pitch components and connectors. The research will determine the controlling factors that create the warpage condition, evaluate the influence of each factor, and determine which parameters can be controlled or eliminated in order to reduce the degree of stress related circuit card warpage. Both experimental and numerical techniques will be used for this evaluation.

这项研究是针对印刷线路板的翘曲，这是一个越来越有害的因素，在装配小间距组件和连接器。研究将确定产生翘曲条件的控制因素，评估每个因素的影响，并确定可以控制或消除哪些参数，以降低与电路卡翘曲有关的应力程度。本次评估将采用实验和数值技术。