Laser Ultrasound-Interferometric System for Packaged Electronic Devices Quality Evaluations

这笔资金将用于开发一种新的质量检查系统，该系统将评估封装电子设备中的缺陷。此类缺陷将包括未对准、短路、缺失、破裂、空化、分层、部分连接、开放、过多和饥饿的焊料凸起，这些凸起出现在倒装芯片(无底部填充)、直接芯片贴合(DCA)、芯片规模封装(CSP)以及芯片电容器和电阻器的裂缝中。PI建议开发一种自动激光超声干涉系统，使用一根光纤来评估封装电子设备的质量。该系统可以在生产线上作为通过/不通过的检测工具使用，也可以在工艺开发过程中离线使用，以进行工艺优化。这将是一个高分辨率、非接触、无损、低成本、快速准确的质量检测系统。PI还将开发一种信号处理程序，以确定是否存在一个或多个此类缺陷。将建立有限元分析模型来解释实验结果。最终目标是利用在这项研究中获得的经验来建立一个工业级原型系统，作为工业中的Beta测试使用。PI和他的学生将迅速将这项技术转移到该行业。这项研究将导致开发一种新型的、自动化的、非接触、无损、快速、灵敏、准确和低成本的焊料凸点质量检测系统。预计它还将适用于多种类型的表面贴装设备，如片式电阻器和电容器，以及传统的引线框架封装，使其成为一种多功能且具有成本效益的自动化制造工具。该工具可在线用作通过/不通过检测工具，也可在工艺开发过程中离线使用，以实现工艺优化。将这一新的激光超声干涉检测技术用于自动化制造检测，通过在工艺早期发现缺陷，将带来巨大的成本节约。随着快速、准确的检测系统的使用，通过缩短新产品的上市时间并在生产投产之前实现更好的工艺优化，还将在工艺开发中实现成本节约。如果研究目标完全实现，所提出的技术将有助于提高DCA、倒装芯片、CSP、硅芯片以及片式电阻和电容器的成品率。这项研究将通过培训这些学生开发和应用低成本和高性能的传感器，用于微电子封装设备的在线和离线质量评估，从而影响国家的人力资源。参与这项研究的学生将学习如何在微电子封装、激光超声、光学技术、系统集成、信号处理和有限元建模方面进行应用和基础研究。他们还将学习技术许可和商业化

This grant provides funding to develop a novel quality inspection system that will evaluate the defects in packaged electronic devices. Such defects would include misaligned, short, missing, cracked, voided, delaminated, partially connected, open, excessive and starved solder bumps that occur in such packaged devices as flip chip (with no underfill), direct chip attach (DCA), chip scale packaging (CSP), and cracks in chip capacitors and resistors. The PI proposes to develop an automated laser ultrasonic-interferometric system that uses a single optical fiber for evaluating the quality of packaged electronic devices. This system can be used in a production line as a go/no-go inspection tool, or off-line during process development for process optimization. This will be a high resolution, non-contact, non-destructive, low cost, fast and accurate quality inspection system. The PI will also develop a signal processing procedure for determining the presence of one or more of these defects. A finite element analysis model will be developed to explain the experimental results. The final objective is to use the experiences gained in the conduct of this study to build an industrial grade prototype system for use as a Beta test in industry. The PI and his students will swiftly transfer this technology to the industry. This research will result in the development of a novel and automated non-contact, non-destructive, fast, sensitive, accurate and low cost solder bump quality inspection system. It is also expected to be applicable to many types of surface mount devices such as chip resistors and capacitors, and conventional lead frame packages, making it a versatile and cost-effective automated manufacturing tool. This tool could be used on-line as a go/no-go inspection tool, and off-line during process development for process optimization. Use of this new Laser Ultrasound-Interferometric inspection technology for automated manufacturing inspection will bring tremendous cost savings by catching defects early in the process. With access to rapid, accurate inspection systems, cost savings will also be realized in process development by reducing the time to market new products, and allowing better process optimization before manufacturing ramp-up. If the research objectives are fully implemented, the proposed technique will help to increase the yield of DCAs, flip chips, CSPs, silicon chips, and chip resistors and capacitors. The research will impact the nation's human resources by training these students in the development and application of low cost and high performance sensors, for on-line and off-line quality evaluation of microelectronic packaging devices. The students who will be participating in this research will learn how to carry out applied and fundamental research in microelectronic packaging, on laser ultrasound, on optical techniques, on system integration, on signal processing and on finite element modeling. They will also learn about technology licensing and commercialization