Laser Ultrasound-Interferometric System for Packaged Electronic Devices Quality Evaluations

用于封装电子器件质量评估的激光超声干涉系统

• 批准号: 0217311
• 负责人: I. Charles Ume
• 金额: $ 30.22万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-08-15 至 2006-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0217311&HistoricalAwards=false
• 关键词: Laser; Ultrasound; Interferometric; System; Packaged

This grant provides funding to develop a novel quality inspection system that will evaluate the defects in packaged electronic devices. Such defects would include misaligned, short, missing, cracked, voided, delaminated, partially connected, open, excessive and starved solder bumps that occur in such packaged devices as flip chip (with no underfill), direct chip attach (DCA), chip scale packaging (CSP), and cracks in chip capacitors and resistors. The PI proposes to develop an automated laser ultrasonic-interferometric system that uses a single optical fiber for evaluating the quality of packaged electronic devices. This system can be used in a production line as a go/no-go inspection tool, or off-line during process development for process optimization. This will be a high resolution, non-contact, non-destructive, low cost, fast and accurate quality inspection system. The PI will also develop a signal processing procedure for determining the presence of one or more of these defects. A finite element analysis model will be developed to explain the experimental results. The final objective is to use the experiences gained in the conduct of this study to build an industrial grade prototype system for use as a Beta test in industry. The PI and his students will swiftly transfer this technology to the industry. This research will result in the development of a novel and automated non-contact, non-destructive, fast, sensitive, accurate and low cost solder bump quality inspection system. It is also expected to be applicable to many types of surface mount devices such as chip resistors and capacitors, and conventional lead frame packages, making it a versatile and cost-effective automated manufacturing tool. This tool could be used on-line as a go/no-go inspection tool, and off-line during process development for process optimization. Use of this new Laser Ultrasound-Interferometric inspection technology for automated manufacturing inspection will bring tremendous cost savings by catching defects early in the process. With access to rapid, accurate inspection systems, cost savings will also be realized in process development by reducing the time to market new products, and allowing better process optimization before manufacturing ramp-up. If the research objectives are fully implemented, the proposed technique will help to increase the yield of DCAs, flip chips, CSPs, silicon chips, and chip resistors and capacitors. The research will impact the nation's human resources by training these students in the development and application of low cost and high performance sensors, for on-line and off-line quality evaluation of microelectronic packaging devices. The students who will be participating in this research will learn how to carry out applied and fundamental research in microelectronic packaging, on laser ultrasound, on optical techniques, on system integration, on signal processing and on finite element modeling. They will also learn about technology licensing and commercialization

这项拨款为开发一种新的质量检测系统提供资金，该系统将评估封装电子设备中的缺陷。这些缺陷包括错位、短、缺失、裂纹、空洞、分层、部分连接、打开、过多和缺乏焊点，这些缺陷发生在诸如倒装芯片（没有下填充）、直接芯片连接（DCA）、芯片规模封装（CSP）以及芯片电容器和电阻的裂纹等封装器件中。PI建议开发一种自动化激光超声干涉测量系统，该系统使用一根光纤来评估封装电子设备的质量。该系统可以在生产线上用作进行/不进行检查的工具，也可以在工艺开发期间离线用于工艺优化。这将是一个高分辨率、非接触、无损、低成本、快速、准确的质量检测系统。PI还将制定信号处理程序，以确定这些缺陷中的一个或多个是否存在。将建立一个有限元分析模型来解释实验结果。最后的目标是利用在进行这项研究中获得的经验来建立一个工业级原型系统，用于工业中的Beta测试。PI和他的学生将迅速将这项技术转移到工业界。本研究将有助于开发一种新型的自动化非接触、无损、快速、灵敏、准确和低成本的凸点质量检测系统。它也有望适用于许多类型的表面贴装器件，如片式电阻和电容器，以及传统的引线框架封装，使其成为一种通用且具有成本效益的自动化制造工具。该工具可以在线使用作为进行/不进行检查的工具，也可以离线在工艺开发过程中用于工艺优化。使用这种新的激光超声干涉检测技术进行自动化制造检测，通过在过程的早期发现缺陷，将节省巨大的成本。有了快速、准确的检测系统，通过缩短新产品上市时间，并在生产增加之前进行更好的工艺优化，也将在工艺开发中实现成本节约。如果研究目标完全实现，所提出的技术将有助于提高dca，倒装芯片，csp，硅芯片和芯片电阻和电容器的产量。该研究将通过培训这些学生开发和应用低成本和高性能传感器，用于微电子封装器件的在线和离线质量评估，从而影响国家的人力资源。参与本研究的学生将学习如何在微电子封装、激光超声、光学技术、系统集成、信号处理和有限元建模方面进行应用和基础研究。他们还将学习有关技术许可和商业化的知识