Interconnect Models for Computer Aided Design of Multi-GHz Multichip Modules and Integrated Circuits

这笔赠款资助开发电动模型的 多芯片模块（MCM）中的互连， 千兆赫频率。 在这些频率下， 即使不是主导作用也会有显著的影响。 MCM是下一个 代封装技术。 需要更好的MCM模型， 利用MCM提供的机会， 模拟和数字性能的增强 electronics. 这些模型将从实验中获得， 分析和模拟研究。 结果将是表格 具有可嵌入MCM设计中的插值例程 规则并由单独的MCM CAD工具调用。

This grant funds the development of electrical models of the interconnections in Multichip Modules (MCMs) that are useful at Gigahertz frequencies. At these frequencies the interconnections have a significant if not dominant effect. MCMs are the next generation packaging technique. Better MCM models are needed to exploit the opportunities that MCMs offer for essential enhancements in the performance of both analog and digital electronics. The models will be obtained from experimental, analytical, and simulation studies. The outcome will be tables with routines for interpolation that can be imbedded in MCM design rules and invoked by separate MCM CAD tools.