Interconnect Models for Computer Aided Design of Multi-GHz Multichip Modules and Integrated Circuits

多 GHz 多芯片模块和集成电路计算机辅助设计的互连模型

• 批准号: 9017054
• 负责人: Michael Steer
• 金额: $ 27.35万
• 依托单位: North Carolina State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1991
• 资助国家: 美国
• 起止时间: 1991-02-15 至 1994-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9017054&HistoricalAwards=false
• 关键词: Interconnect; Models; Computer; Aided; Design

This grant funds the development of electrical models of the interconnections in Multichip Modules (MCMs) that are useful at Gigahertz frequencies. At these frequencies the interconnections have a significant if not dominant effect. MCMs are the next generation packaging technique. Better MCM models are needed to exploit the opportunities that MCMs offer for essential enhancements in the performance of both analog and digital electronics. The models will be obtained from experimental, analytical, and simulation studies. The outcome will be tables with routines for interpolation that can be imbedded in MCM design rules and invoked by separate MCM CAD tools.

这笔赠款资助开发电动模型的 多芯片模块（MCM）中的互连，可用于 千兆赫频率。 在这些频率下，相互连接 即使不是主导作用也会有显著的影响。 MCM是下一个 代封装技术。 需要更好的MCM模型， 利用MCM提供的机会， 模拟和数字性能的增强 electronics. 这些模型将从实验中获得， 分析和模拟研究。 结果将是表格 具有可嵌入MCM设计中的插值例程 规则并由单独的MCM CAD工具调用。