Interconnect Models for Computer Aided Design of Multi-GHz Multichip Modules and Integrated Circuits

这笔赠款资助了多芯片模块 (MCM) 中互连电气模型的开发，这些模型在千兆赫频率下很有用。 在这些频率下，互连即使不是主导效应，也会产生显着的影响。 MCM 是下一代封装技术。 需要更好的 MCM 模型来利用 MCM 提供的机会，从而显着增强模拟和数字电子产品的性能。 这些模型将从实验、分析和模拟研究中获得。 结果将是包含插值例程的表格，这些插值例程可以嵌入 MCM 设计规则中并由单独的 MCM CAD 工具调用。

This grant funds the development of electrical models of the interconnections in Multichip Modules (MCMs) that are useful at Gigahertz frequencies. At these frequencies the interconnections have a significant if not dominant effect. MCMs are the next generation packaging technique. Better MCM models are needed to exploit the opportunities that MCMs offer for essential enhancements in the performance of both analog and digital electronics. The models will be obtained from experimental, analytical, and simulation studies. The outcome will be tables with routines for interpolation that can be imbedded in MCM design rules and invoked by separate MCM CAD tools.