Integration of Micromechanical and Vacuum Microelectronic Devices

点击翻译按钮获取中文摘要

This research will examine the feasibility of combining vacuum microelectronics and microelectromechanical devices together on the same silicon chip. Specifically, it will examine the feasibility of using vacuum microelectronics to drive a silicon micromotor. The technologies that could be developed under this grant could also apply to combination of electronics and micro-sensors capable of withstanding harsh environments-high temperature, high nuclear irradiation flux--together on a single chip. The major objectives of this research are to compare technology options available for both vacuum microelectronics and microelectromechanical devices, to select a compatible set, to design a silicon micromotor compatible with vacuum microelectronic drive circuits, and to begin fabrication of the design.