Integration of Micromechanical and Vacuum Microelectronic Devices

这项研究将检验在同一硅片上将真空微电子学和微电子机械设备结合在一起的可行性。具体地说，它将研究使用真空微电子技术驱动硅微电机的可行性。根据这笔赠款可以开发的技术也可以应用于能够承受恶劣条件的电子和微型传感器的组合。环境--高温、高核辐射通量--集成在一块芯片上。这项研究的主要目标是比较真空微电子和微电子机械设备，为了选择兼容的装置，为了设计与真空微电子驱动电路兼容的硅微电机，并开始制造该设计。

This research will examine the feasibility of combining vacuum microelectronics and microelectromechanical devices together on the same silicon chip. Specifically, it will examine the feasibility of using vacuum microelectronics to drive a silicon micromotor. The technologies that could be developed under this grant could also apply to combination of electronics and micro-sensors capable of withstanding harsh environments-high temperature, high nuclear irradiation flux--together on a single chip. The major objectives of this research are to compare technology options available for both vacuum microelectronics and microelectromechanical devices, to select a compatible set, to design a silicon micromotor compatible with vacuum microelectronic drive circuits, and to begin fabrication of the design.