Constitutive Modelling of Mechanical Response of Materials in Semiconductor Devices with Emphasis on Interface Behavior

半导体器件中材料机械响应的本构建模，重点关注界面行为

• 批准号: 9102177
• 负责人: Chandra Desai
• 金额: $ 19.28万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1991
• 资助国家: 美国
• 起止时间: 1991-08-15 至 1994-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9102177&HistoricalAwards=false
• 关键词: Constitutive; Modelling; Mechanical; Response; Materials

Realistic characterization and understanding of the mechanical response of materials and interfaces in semiconductor devices such as chip-substrate and packaging are vital for improved and competitive designs in manufacturing. Most of the previously used constitutive models do not account for important factors such as inelastic response, fracture, damage, delamination and degradation under thermomechanical and viscous (creep) effects, in an integrated manner. The objective of the research is to develop a unified modeling approach that will allow incorporation of the above factors in the behavior of both solid materials and interfaces in the semiconductor devices. The models thus developed will be verified with respect to available test results from laboratory measurements. Semiconductor devices are extremely complex systems, often involving interfaces between brittle and ductile materials. Because of the complexity of the system, failures are hard to predict and, therefore, failure-resistant designs are difficult to achieve. The reseach work will develop a much more sophisticated approach to the design of semiconductor devices and packaging than those which are currently available.

机械的现实表征和理解 半导体器件中的材料和界面的响应 因为芯片衬底和封装对于改进和 在制造业中有竞争力的设计 以前使用的大多数 本构模型不考虑重要因素， 非弹性响应、断裂、损伤、分层和退化 在热机械和粘性（蠕变）效应下， 综合方式。 研究的目的是开发一种 统一的建模方法，将允许纳入 上述因素在固体材料和 半导体器件中的接口。 由此开发的模型 将根据以下方面的可用测试结果进行验证： 实验室测量 半导体器件是极其复杂的系统，通常 涉及脆性和韧性材料之间的界面。 由于系统的复杂性， 因此，抗故障设计很难预测， achieve. 这项研究工作将发展出一种更为复杂的 半导体器件和封装设计的方法比 那些目前可用的。