Unified Constitutive Modelling, Testing and Computer Design for Semiconductor Devices with Emphasis on Interfaces Behavior

9313204德赛半导体和封装制造的竞争性和创新性设计取决于对各种芯片-基板和封装系统中材料和界面的热机械行为的了解和了解。目前可用于描述这种行为的本构模型和计算机软件不足以考虑各种重要的设计因素，如弹性、塑性和蠕变应变、损伤、退化和软化、相对运动(滑移、分层和翘曲)、疲劳以及在热、机械和其他环境(例如，湿度)载荷下的破坏循环。能够进行宏观和微观测量以确定固体(芯片和衬底)和界面材料的实际材料常数的适当实验室测试设备和程序也不是现成的。这项研究的目标是：(1)开发一种统一的本构模型方法，该方法可以将固体和界面的上述因素包括在一个通用的数学框架中，该框架可以根据具体的应用需要选择简单到高级的模型，(2)进行全面的实验室测试。(3)利用试验数据确定建议模型的材料常数，并根据试验结果对模型进行验证；(4)采用非线性、时间相关的有限元程序实现模型，并注意其稳健性和可靠性；以及(5)开发可用于改进和优化设计和制造的软件。拟议的计算工具的可用性将允许为半导体器件设计更可靠和更高性能的封装。

9313204 Desai Competitive and innovative designs for semiconductor and packaging manufacturing are dependent on the knowledge and understanding of the thermo-mechanical behavior of materials and interfaces in various chip-substrate and packaging systems. The currently available constitutive models and computer software to characterize such behavior are not adequate to allow for various important design factors such as elastic, plastic and creep strains, damage, degradation and softening, relative motions (slippage, delamination and warping), fatigue and cycles to failure under thermal, mechanical and other environmental (e.g., moisture) loadings. Appropriate laboratory testing devices and procedures that can allow macro and microlevel measurements leading to determination of realistic material constants for both solid ( chip and substrate) and interface materials are also not readily available. The objective of this research is to develop: (1) a unified constitutive modelling approach that can permit inclusion of the above factors for solids and interfaces, in a common mathematical framework that can permit selection of simple to advanced models depending upon the specific application need, (2) to perform comprehensive laboratory tests. (3) to determine material constants for the proposed models using the test data, and to verify the models with respect to the test results, (4) to implement the models in nonlinear, time dependent finite element procedures with attention to their robustness and reliability, and (5) to develop software that can be used for improved and optimized designs and manufacturing. The availability of the proposed computational tools will allow the design of more reliable and higher performance packages for semiconductor devices.