Unified Constitutive Modelling, Testing and Computer Design for Semiconductor Devices with Emphasis on Interfaces Behavior

强调接口行为的半导体器件统一本构建模、测试和计算机设计

• 批准号: 9313204
• 负责人: Chandra Desai
• 金额: $ 42万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1994
• 资助国家: 美国
• 起止时间: 1994-05-15 至 1999-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9313204&HistoricalAwards=false
• 关键词: Unified; Constitutive; Modelling; Testing; Computer

9313204 Desai Competitive and innovative designs for semiconductor and packaging manufacturing are dependent on the knowledge and understanding of the thermo-mechanical behavior of materials and interfaces in various chip-substrate and packaging systems. The currently available constitutive models and computer software to characterize such behavior are not adequate to allow for various important design factors such as elastic, plastic and creep strains, damage, degradation and softening, relative motions (slippage, delamination and warping), fatigue and cycles to failure under thermal, mechanical and other environmental (e.g., moisture) loadings. Appropriate laboratory testing devices and procedures that can allow macro and microlevel measurements leading to determination of realistic material constants for both solid ( chip and substrate) and interface materials are also not readily available. The objective of this research is to develop: (1) a unified constitutive modelling approach that can permit inclusion of the above factors for solids and interfaces, in a common mathematical framework that can permit selection of simple to advanced models depending upon the specific application need, (2) to perform comprehensive laboratory tests. (3) to determine material constants for the proposed models using the test data, and to verify the models with respect to the test results, (4) to implement the models in nonlinear, time dependent finite element procedures with attention to their robustness and reliability, and (5) to develop software that can be used for improved and optimized designs and manufacturing. The availability of the proposed computational tools will allow the design of more reliable and higher performance packages for semiconductor devices.

小行星9313204 具有竞争力和创新性的半导体和 包装制造依赖于知识和 了解材料的热机械行为， 各种芯片基板和封装系统中的接口。 的 目前可用的本构模型和计算机软件， 这种行为的特点是不足以允许各种 重要的设计因素，如弹性、塑性和蠕变 应变、损坏、降解和软化、相对运动 （滑移、分层和翘曲）、疲劳和失效周期 在热、机械和其它环境下（例如，湿度） 装载量。 适当的实验室测试设备和程序 可以进行宏观和微观测量， 确定固体（芯片）和非固体（芯片）的实际材料常数 和基底）和界面材料也不容易 available. 本研究的目的是：（1）建立一个 统一的本构建模方法，可以允许包含 在上述固体和界面的因素中， 数学框架，可以允许选择简单的， 根据具体应用需求提供先进的型号，（2） 进行全面的实验室测试。 (3)以确定 使用试验数据确定所提出模型的材料常数，并根据试验结果验证模型，（4） 在非线性时变有限元中实现模型 注意程序的稳健性和可靠性，以及 (5)开发可用于改进和优化 设计和制造。 拟议的计算工具的可用性将 允许设计更可靠和更高性能的封装 用于半导体器件。