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RIA: Experimental Simulation of Crack Initiation at Bimaterial Interfaces due to Mechanical and Thermal Loads

RIA：机械和热载荷导致的双材料界面裂纹萌生的实验模拟

基本信息

批准号：
9109731
负责人：
Hareesh Tippur
金额：
$ 6.94万
依托单位：
Auburn University
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
1991
资助国家：
美国
起止时间：
1991-09-15 至 1994-08-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9109731&HistoricalAwards=false
关键词：
RIA Experimental Simulation Crack Initiation

项目摘要

Experimental research, dealing with quasi-static and dynamic crack initiation and growth at material interfaces subjected to mechanical and thermal loading, will be carried out. The research will contribute to a better understanding of interfacial failure mechanisms which predominantly control the fracture behavior of multi-phase materials such as polymer and metal matrix composites, metal filled composites, and of adhesive bonds and thin films on substrates. The proposed work is concerned with crack initiation and growth simulations under controlled loading conditions in bimaterial specimens. Interfacial crack tip deformations will be optically measured prior to and at fracture initiation. A newly developed, real time, full field optical technique, 'Coherent Gradient Sensing' (CGS), will be utilized as an experimental tool for measuring deformations near interfacial cracks. From these high resolution optical measurements, local crack tip parameters such as complex stress intensity factor and crack tip mode mixity will be inferred. The optical measurements will allow us to seek relationships between the local crack tip parameters and external/material parameters such as remote loading and material property mismatch. This will provide valuable data for identifying parameters which significantly influence crack initiation at interfaces and for establishing interfacial failure criteria.

准静态和动态裂纹的实验研究在材料界面处的引发和生长，机械和热负荷，将进行。研究将有助于更好地理解界面失效主要控制断裂行为的机制多相材料如聚合物和金属基复合材料，金属填充复合材料以及粘合剂和薄膜印刷受体. 建议的工作是有关裂纹萌生在受控加载条件下的生长模拟，双材料标本界面裂纹尖端变形将是在断裂开始之前和断裂开始时进行光学测量。一个新开发的，真实的时间，全场光学技术，“相干梯度传感（CGS），将被用作实验工具用于测量界面裂纹附近的变形。从这些高分辨率光学测量，局部裂纹尖端参数，裂纹尖端应力分布如复应力强度因子和裂纹尖端模态混合度将被推断。光学测量将使我们能够寻找局部裂尖参数与外部/材料参数，如远程加载和材料属性不匹配。这将为识别显著影响裂纹萌生的参数，界面和建立界面失效标准。