Interface Crack Initiation Under Thermo-Mechanical Loads

9313153 Tippur将开展一项实验研究计划，探索在热机械载荷作用下沿材料界面的裂纹萌生和扩展。这项研究将有助于理解由聚合物和金属基复合材料制成的工程结构、飞机中的胶接接头以及层状微电子器件中的接口的失效机理。预计这项研究将有助于模拟瞬时热载荷和温度梯度对裂纹萌生韧性和模式混合性的影响，并开发表征热机械载荷作用下双材料界面断裂的新方法。主要的重点将是了解由于热机械载荷而导致裂纹沿材料界面萌生和扩展的预起裂裂纹尖端场的瞬变性质。***

9313153 Tippur An experimental research program will be undertaken that explores crack initiation and growth along material interfaces subjected to thermo-mechanical loads. This investigation will assist in understanding the failure mechanics of engineering structures made of polymer and metal matrix composites, adhesive joints in aircrafts, and interfaces in layered micro-electronic devices. It is anticipated that the research will contribute towards modeling the influence of transient thermal loads and thermal gradients on crack initiation toughness and mode mixity and developing new methods for characterizing fracture of bimaterial interface subjected to thermo-mechanical loading. The primary focus will be towards understanding the transient nature of the pre-initiation crack tip fields that lead to crack initiation and propagation along material interfaces due to thermo-mechanical loading. ***