Interface Crack Initiation Under Thermo-Mechanical Loads

将开展一项实验研究项目，探索材料界面在热机械载荷作用下的裂纹萌生和扩展。这项研究将有助于理解由聚合物和金属基复合材料制成的工程结构、飞机上的粘合接头和层状微电子设备中的界面的失效机制。预计该研究将有助于模拟瞬态热载荷和热梯度对裂纹起裂韧性和模态混合的影响，并为热-机械载荷作用下双材料界面断裂的表征提供新的方法。主要的焦点将是理解由于热机械载荷导致裂纹沿材料界面起裂和扩展的预起裂尖端场的瞬态性质。＊＊＊

9313153 Tippur An experimental research program will be undertaken that explores crack initiation and growth along material interfaces subjected to thermo-mechanical loads. This investigation will assist in understanding the failure mechanics of engineering structures made of polymer and metal matrix composites, adhesive joints in aircrafts, and interfaces in layered micro-electronic devices. It is anticipated that the research will contribute towards modeling the influence of transient thermal loads and thermal gradients on crack initiation toughness and mode mixity and developing new methods for characterizing fracture of bimaterial interface subjected to thermo-mechanical loading. The primary focus will be towards understanding the transient nature of the pre-initiation crack tip fields that lead to crack initiation and propagation along material interfaces due to thermo-mechanical loading. ***