Interface Crack Initiation Under Thermo-Mechanical Loads

9313153蒂普尔将进行一项实验研究计划，探讨裂纹萌生和增长沿着材料界面受到热机械负荷。 这项研究将有助于理解聚合物和金属基复合材料制成的工程结构的失效机理，在飞机上的粘接接头，和分层微电子器件的接口。 预计这项研究将有助于模拟瞬态热载荷和热梯度对裂纹萌生韧性和模式混合度的影响，并开发新的方法来表征热机械载荷下双材料界面的断裂。 主要的焦点将是理解导致裂纹萌生和扩展的预裂纹尖端场的瞬态性质 沿着材料界面。 ***

9313153 Tippur An experimental research program will be undertaken that explores crack initiation and growth along material interfaces subjected to thermo-mechanical loads. This investigation will assist in understanding the failure mechanics of engineering structures made of polymer and metal matrix composites, adhesive joints in aircrafts, and interfaces in layered micro-electronic devices. It is anticipated that the research will contribute towards modeling the influence of transient thermal loads and thermal gradients on crack initiation toughness and mode mixity and developing new methods for characterizing fracture of bimaterial interface subjected to thermo-mechanical loading. The primary focus will be towards understanding the transient nature of the pre-initiation crack tip fields that lead to crack initiation and propagation along material interfaces due to thermo-mechanical loading. ***