Low-Cost Technologies for Microelectromechanical Systems

研究提出了三个相对较低的成本 和可制造的技术， 微机电系统（MEMS）， 将有助于实现商业 这些系统的发展。 第一技术 是一个将光学质量 化合物半导体材料到硅上- 基于微结构。 这项技术， 基于外延剥离的改进 化合物半导体材料的技术， 将使集成光学的发展成为可能- 基于传感器和执行器。 第二 技术涉及使用电镀 技术与聚酰亚胺基 电镀形式，以生产低成本 替代LIGA工艺制造 高纵横比微结构。 第三 技术包括设计和制造 简单的太阳能电池结构， 包含MEMS的电源。 太阳能电池 结构将针对高电压进行优化， 静电微致动器的低电流需求， 并且设计成它们可以被整合到 直接与标准硅基微结构结合。

Research is proposed on three relatively low cost and manufacturable technologies for microelectromechanical systems (MEMS), which will contribute toward enabling commercial development of these systems. The first technology is a process for integrating optical-quality compound semiconductor materials onto silicon- based microstructures. This technology, which is based on a modification of epitaxial liftoff techniques for compound semiconductor materials, will enable the development of integrated optically- based sensors and actuators. The second technology involves the use of electroplating techniques coupled with polyimide-based electroplating forms to produce a low-cost alternative to the LIGA process for fabrication of high-aspect-ration microstructures. The third technology involves the design and fabrication of simple solar cell structures that can be used as self- contained power sources for MEMS. The solar cell structures will be optimized for the high-voltage, low-current needs of electrostatic microactuators, and designed such that they can be integrated directly with standard silicon-based microstructures.