Engineering Research Equipment Grant: Development of Packaging Design Support Environment

该奖项是为计算机设备，以增加在电子封装研究中心的电气和计算机工程系，亚利桑那大学。该设备将使该中心继续向计算机辅助超大规模集成互连设计和分析的新兴领域迈进，该中心拥有大量人员进行电子封装研究。该设备将促进涉及数字和符号处理的大型软件系统的开发和测试。

This award is for computer equipment to augment that in the Center for Electronic Packaging Research of the Department of Electrical and Computer Engineering, University of Arizona. The equipment will enable the Center, which is well staffed to carry out research in electronic packaging, to continue to move into the emerging area of computer-aided Very Large Scaled Integration interconnection design and analysis. The equipment will facilitate the development and testing of a large scale software system involving both numerical and symbolic processing.