Engineering Research Equipment Grant: Development of Packaging Design Support Environment

该奖项授予亚利桑那大学电子与计算机工程系电子封装研究中心的计算机设备。这些设备将使该中心能够继续进入计算机辅助超大规模集成互连设计和分析这一新兴领域。该中心拥有充足的工作人员开展电子封装研究。该设备将有助于开发和测试同时涉及数字和符号处理的大型软件系统。

This award is for computer equipment to augment that in the Center for Electronic Packaging Research of the Department of Electrical and Computer Engineering, University of Arizona. The equipment will enable the Center, which is well staffed to carry out research in electronic packaging, to continue to move into the emerging area of computer-aided Very Large Scaled Integration interconnection design and analysis. The equipment will facilitate the development and testing of a large scale software system involving both numerical and symbolic processing.