6th International Symposium on Nondestructive Characterization of Materials, Oahu, Hawaii, June 7-11, 1993

这个关于材料无损表征的国际研讨会在三个不同的国家举行，间隔时间在3到1年不等。第六届专题讨论会将于1993年6月7日至11日在夏威夷瓦胡岛举行。它有一个由来自5个国家的13名成员组成的国际组织委员会。完整的课程包括：电子元件无损特性和评估；仿生和生物材料；接口;过程控制的无损表征；材料加工模型的验证。本次国际材料无损表征研讨会将是第六次研讨会，在三个不同的国家举行，时间间隔从一到三年不等。它为活跃的科学家和工程师提供了一个交流各自领域最新进展的论坛。它也是材料研究人员和无损检测研究人员交流信息和促进理解的论坛。

This International Symposium on Nondestructive Characterization of Materials has been held in three different countries at intervals varying 3 to 1 years. This 6th symposium will be held in Oahu, Hawaii on June 7-11, 1993. It has an International Organizing Committee of 13 members from 5 countries. The complete program includes sessions on Electronic Component Nondestructive Characterization & Evaluation; Biomimetic and Biotic Materials; Interfaces; Nondestructive Characterization for Process Control; and Verification of Materials Processing Models. %%% This International Symposium on Nondestructive Characterization of Materials will be the sixth symposium, held in three different countries at time intervals varying from one to three years. It provides a forum for active scientists and engineers to exchange the recent advances in their respective fields. It is also a forum for the materials researchers and the nondestructive testing researchers to exchange information and to promote understandings.