6th International Symposium on Nondestructive Characterization of Materials, Oahu, Hawaii, June 7-11, 1993

第六届材料无损表征国际研讨会，夏威夷瓦胡岛，1993 年 6 月 7-11 日

• 批准号: 9224814
• 负责人: Robert Green
• 金额: $ 1.5万
• 依托单位: Johns Hopkins University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-05-01 至 1994-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9224814&HistoricalAwards=false
• 关键词: 6th; International; Symposium; Nondestructive; Characterization

This International Symposium on Nondestructive Characterization of Materials has been held in three different countries at intervals varying 3 to 1 years. This 6th symposium will be held in Oahu, Hawaii on June 7-11, 1993. It has an International Organizing Committee of 13 members from 5 countries. The complete program includes sessions on Electronic Component Nondestructive Characterization & Evaluation; Biomimetic and Biotic Materials; Interfaces; Nondestructive Characterization for Process Control; and Verification of Materials Processing Models. %%% This International Symposium on Nondestructive Characterization of Materials will be the sixth symposium, held in three different countries at time intervals varying from one to three years. It provides a forum for active scientists and engineers to exchange the recent advances in their respective fields. It is also a forum for the materials researchers and the nondestructive testing researchers to exchange information and to promote understandings.

本次国际无损检测研讨会 材料表征已在三个不同的 国家之间的间隔为3至1年不等。 第六届研讨会 将于1993年6月7日至11日在夏威夷的奥廷加举行。 它有一个 国际组织委员会，由来自5个国家的13名成员组成。 完整的课程包括电子元件课程 非破坏性表征评价;仿生和生物 材料;界面;过程的非破坏性表征 控制;和材料加工模型的验证。 %%% 本次国际无损检测研讨会 材料表征将是第六次研讨会，在 三个不同的国家，时间间隔从一到 三年 它为活跃的科学家提供一个论坛， 工程师交流各自的最新进展， 领域的 它也是材料研究人员和 无损检测研究人员交流信息， 促进理解。