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RESEARCH INITIATION AWARD: The Full Wave Analysis of High Speed Electrical Interconnects for VLSI Packaging on High Performance Multiprocessor Computers

RESEARCH INITIATION AWARD: The Full Wave Analysis of High Speed Electrical Interconnects for VLSI Packaging on High Performance Multiprocessor Computers
研究启动奖:高性能多处理器计算机上 VLSI 封装的高速电气互连的全波分析
批准号:
9309179
负责人:
Stephen Gedney
金额:
$9.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1993
资助国家:
美国
项目状态:
已结题
起止时间:
1993-08-15 至 1997-01-31

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中文摘要
翻译
9309179格德尼这个项目的目的是技术的发展,将提供复杂的电气互连网络的VLSI封装的全波分析。 为了加速高性能VLSI器件的开发,准确有效的分析工具对于正确设计电子互连线是必不可少的。 原则上,这些方法将提供,1)在宽频率范围内的传输线等效电路参数的提取,2)在复杂环境中的互连蚀刻,信号线,引线或其他耦合线之间的耦合的建模,以及3)三维互连网络上的脉冲传播的精确模拟。 所提出的分析技术基于:i)基于非结构化网格的广义Yee算法,以及ii)基于高阶向量元素的时域有限元方法。 这些方法具有很强的鲁棒性,能够模拟复杂环境中的时间场,并且具有很高的计算效率。 此外,它们被设计为与计算机辅助建模和工具接口,以方便设计工程师。 复杂电互连网络的模拟将导致潜在的109自由度的相当大的问题。 为了促进这种规模的问题,提出了有效的prarterm算法。 具体地,空间分解技术将用于广义Yee算法和时域有限元方法,而基于区域分解方法的有效迭代矩阵求解算法,例如, 添加剂施瓦茨方法与粗预处理器的基础上的线篮为基础的方法,将被研究的时域有限元方法的方法。 ***
英文摘要
9309179 Gedney The purpose of this project is the development of techniques that will provide the fullwave analysis of complex electrical interconnect networks of VLSI packages. To facilitate the accelerated development of high performance VLSI devices, accurate and efficient analysis tools are essential for the proper design of the electronic interconnects. Principally, these methods will provide, 1) the extraction of transmission-line equivalent circuit parameters over a broad frequency range, 2) the modeling of coupling between interconnect etchs, signal lines, leads, or other coupled lines in complex environments, and 3) accurate simulations of pulse propagation on three-dimensional interconnect networks. The proposed analysis techniques are based on: i) a generalized Yee-algorithm based on unstructured grids, and ii) a time- domain finite element method based on higher-order vector elements. These methods are extremely robust, and are capable of simulating temporal field in complex environment, as well as being highly computationally efficient. Furthermore, they are designed to be interfaced with computer aided modeling and tools to facilitate the design engineer. The simulation of complex electrical interconnect networks will lead to sizable problems with potentially 109 degree of freedom. To facilitate problems of this scale, efficient prarallel algorithms are proposed. Specifically, spatial decomposition techniques will be used for both the generalized Yee- algorithm and the time domain finite element method, while efficient iterative matrix solution algorithms based on domain decomposition methods, e.g., additive Schwarz methods with a coarse preconditioner based on a wire-basket based method, will be studied for the time-domain finite element method approach. ***
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CAREER: Full Wave Analysis of Electronic Packaging on High Performance Computers
Mathematical Sciences: Scientific Computing Research Environments for the Mathematical Sciences
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