Instability of the Wetting Tip in Lead-Free Solder Reactions

无铅焊接反应中润湿头的不稳定性

• 批准号: 9320769
• 负责人: King-Ning Tu
• 金额: $ 27.11万
• 依托单位: University of California-Los Angeles
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1994
• 资助国家: 美国
• 起止时间: 1994-08-01 至 1997-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9320769&HistoricalAwards=false
• 关键词: Instability; Wetting; Tip; Lead; Free

9320769 Tu This program provides a systematic research effort on tin-bismuth- antimony-based solders. Their wetting behavior on copper and silica/chromium/copper/gold surfaces is measured and compared to lead-tin solders. The science of instability at the wetting tip due to dynamic interfacial reaction between the liquid solder and the solid copper is emphasized in this study. For this purpose cross-sectional transmission electron microscopy of the reaction at the wetting tip using thin film samples is employed. Also solder wetting on single crystal surfaces of copper is examined. This wetting behavior is the most important processing parameter in the selection of lead-free solder for electronic packaging. Both low melting point (about 180C) and high melting point (about 300C) lead-free solders will be studied. %%% The lead-based solder used in microelectronic devices is an environment issue. For environmental conscious manufacturing lead replacement and reliable lead-free solders are urgent issues. ***

[9320769]屠本项目对锡铋锑基焊料进行了系统的研究。测量了它们在铜和二氧化硅/铬/铜/金表面上的润湿行为，并与铅锡焊料进行了比较。本文着重研究了液体焊料与固体铜之间的动态界面反应所导致的润湿尖端的不稳定性。为此目的，采用薄膜样品在润湿尖端的反应的截面透射电子显微镜。同时对铜单晶表面的焊料润湿进行了研究。在选择电子封装用无铅焊料时，这种润湿性能是最重要的工艺参数。将研究低熔点（约180C）和高熔点（约300C）无铅焊料。微电子器件中使用的铅基焊料是一个环境问题。对于具有环保意识的制造来说，替代铅和可靠的无铅焊料是迫切需要解决的问题。＊＊＊