SBIR Phase II: Augmented Hydrostatic Extrusion for Ultrafine Bonding Wire

SBIR 第二阶段：超细键合线的强化静压挤压

• 批准号: 9321057
• 负责人: Betzalel Avitzur
• 金额: $ 29.99万
• 依托单位: Metalforming Incorporated
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1995
• 资助国家: 美国
• 起止时间: 1995-10-01 至 1998-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9321057&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Augmented; Hydrostatic

9321057 Simchon This SBIR Phase II project addresses a modified, augmented hydrostatic extrusion process for production of very fine wire. Such wire is used as bonding wire in microchips. With the advent of modern micro-electronics, the need for gold and aluminum wire of fine diameter has continuously increased. In the fabrication of very fine wire, severe limits exist on the speed, reduction per mass, and thinness of the emerging wire. In the Phase I study of the processes of wire drawing and augmented hydrostatic extrusion (hydraw) of very fine wire, root causes and the nature of these limitations were studied, both analytically and experimentally. A modified process for Phase II was designed according to criteria developed in this study. Wire of 0.5 mil (0.0125 mm) was produced, and experimental quantities of wire were made on laboratory equipment and tested. The Phase II goal is a production prototype hydraw unit for 0.5 mil gold and aluminum wire. The prototype machine will be used to study the reliability and quality of the wire product and economic parameters of the modified hydraw concept.

小行星9321057 该SBIR第二阶段项目提出了一种改进的、增强的静液挤压工艺，用于生产极细的线材。 这种导线被用作微芯片中的键合导线。 随着现代微电子技术的出现，对细直径金丝和铝线的需求不断增加。 在制造极细的金属丝时，对速度、单位质量的减少量和形成的金属丝的薄度存在严格的限制。 在第一阶段的拉丝和增强静液挤压（液压）非常细的电线，根本原因和这些限制的性质进行了研究，分析和实验。 根据本研究中制定的标准，设计了II期的改良工艺。 生产0.5密耳（0.0125 mm）的线，并且在实验室设备上制备实验量的线并进行测试。 第二阶段的目标是生产0.5密耳金线和铝线的原型液压机组。 样机将用于研究线材产品的可靠性和质量以及改进液压概念的经济参数。