SBIR Phase II: Augmented Hydrostatic Extrusion for Ultrafine Bonding Wire

9321057 SIMCHON该SBIR第二阶段项目旨在采用改进的、增强的静液压挤出工艺来生产超细金属丝。这种焊线被用作微芯片中的键合焊线。随着现代微电子技术的出现，对细径金丝和铝丝的需求不断增加。在制造超细金属丝的过程中，出现的金属丝的速度、单位质量的减少量和细度都有严格的限制。在超细金属丝拉丝和增强静液挤压(HYDRAW)工艺的第一阶段研究中，从分析和实验两方面研究了这些限制的根本原因和性质。根据本研究中制定的标准，设计了第二阶段的改进工艺。生产了0.5mil(0.0125 mm)的钢丝，并在实验室设备上制作了实验量的钢丝并进行了测试。第二阶段的目标是生产50万条黄金和铝线的原型HyDraw装置。样机将用于研究线材产品的可靠性和质量以及改进后的HYDRAW概念的经济参数。

9321057 Simchon This SBIR Phase II project addresses a modified, augmented hydrostatic extrusion process for production of very fine wire. Such wire is used as bonding wire in microchips. With the advent of modern micro-electronics, the need for gold and aluminum wire of fine diameter has continuously increased. In the fabrication of very fine wire, severe limits exist on the speed, reduction per mass, and thinness of the emerging wire. In the Phase I study of the processes of wire drawing and augmented hydrostatic extrusion (hydraw) of very fine wire, root causes and the nature of these limitations were studied, both analytically and experimentally. A modified process for Phase II was designed according to criteria developed in this study. Wire of 0.5 mil (0.0125 mm) was produced, and experimental quantities of wire were made on laboratory equipment and tested. The Phase II goal is a production prototype hydraw unit for 0.5 mil gold and aluminum wire. The prototype machine will be used to study the reliability and quality of the wire product and economic parameters of the modified hydraw concept.