NSF Young Investigator: Analysis and Modeling of High-Speed Interconnects in Electronics Packaging

NSF 青年研究员：电子封装中高速互连的分析和建模

• 批准号: 9357561
• 负责人: Jiayuan Fang
• 金额: $ 31.2万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-07-15 至 1998-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9357561&HistoricalAwards=false
• 关键词: NSF; Young; Investigator; Analysis; Modeling

This research is concerned with the analysis and modeling of electrical performance of high-speed interconnects in electronics packaging. The finite-difference time-domain (FDTD) method, which is a full-wave solution of Maxwell's equations in three dimensions, is used to simulate signal propagation through interconnects. Topics pursued are: 1. Development of a computational scheme for conformed finite-difference grid to model complex-shape interconnects. The objective of this scheme is to enhance the resolution and accuracy of numerical solutions while maintaining the computation efficiency associated with the regular rectangular finite-difference grid. 2. Analysis and modeling of electrical properties of interconnection discontinuities in electronics packaging. Issues involved in this topic include: modeling of electrical characteristics of interconnection discontinuities over the frequency range from dc to tens of gigahertz; evaluation of impacts of parasitics associated with interconnection discontinuities on the propagation of high-clock rate signals; and development of design guidelines for typical interconnection discontinuities in high performance electronics packaging.

这项研究涉及电子封装中高速互连的电气性能分析和建模。 时域有限差分 (FDTD) 方法是麦克斯韦方程组的三维全波解，用于模拟通过互连的信号传播。 所追求的主题是： 1. 开发一致有限差分网格计算方案，以对复杂形状互连进行建模。 该方案的目标是提高数值解的分辨率和精度，同时保持与规则矩形有限差分网格相关的计算效率。 2. 电子封装中互连不连续点的电气特性分析和建模。 本主题涉及的问题包括：从直流到数十千兆赫频率范围内互连不连续性的电气特性建模；评估与互连不连续性相关的寄生效应对高时钟速率信号传播的影响；并制定高性能电子封装中典型互连不连续性的设计指南。