NSF Young Investigator: Analysis and Modeling of High-Speed Interconnects in Electronics Packaging

本研究涉及电子封装中高速互连的电气性能分析与建模。时域有限差分法（FDTD）是三维麦克斯韦方程组的全波解，用于模拟信号在互连中的传播。所追求的主题是：1；建立了一种用于模拟复杂形状互连的合形有限差分网格计算方案。该方案旨在提高数值解的分辨率和精度，同时保持正则矩形有限差分网格的计算效率。2. 电子封装中互连不连续点的电学特性分析与建模。本课题涉及的问题包括：在直流到几十千兆赫的频率范围内，互连不连续的电气特性建模；与互连不连续相关的寄生对高时钟速率信号传播影响的评价以及高性能电子封装中典型互连不连续的设计指南的开发。

This research is concerned with the analysis and modeling of electrical performance of high-speed interconnects in electronics packaging. The finite-difference time-domain (FDTD) method, which is a full-wave solution of Maxwell's equations in three dimensions, is used to simulate signal propagation through interconnects. Topics pursued are: 1. Development of a computational scheme for conformed finite-difference grid to model complex-shape interconnects. The objective of this scheme is to enhance the resolution and accuracy of numerical solutions while maintaining the computation efficiency associated with the regular rectangular finite-difference grid. 2. Analysis and modeling of electrical properties of interconnection discontinuities in electronics packaging. Issues involved in this topic include: modeling of electrical characteristics of interconnection discontinuities over the frequency range from dc to tens of gigahertz; evaluation of impacts of parasitics associated with interconnection discontinuities on the propagation of high-clock rate signals; and development of design guidelines for typical interconnection discontinuities in high performance electronics packaging.