RIA: Electromagnetic Modeling of Interconnections in High Speed Digital Integrated Circuits

本研究是关于电性能的精确模型 数字电路上的互连。 维护 当信号传播通过各种不同的 互联是正常运作的关键因素， 集成电路（IC）。 对于非常高速的IC， 信号传播的复杂电磁性质。 复杂互连结构的精确模型是 很难获得。 在正在开发的模型中， 信号通过互连传播的响应是 用三维全波有限差分表示 在时域中求解麦克斯韦方程。 该溶液 被开发以符合互连几何形状 在多层IC中发现。 注意激发 和吸收边界条件，以确保高度的 数值精度 各种互连结构正被 分析，特别考虑到弯曲， 不同的角度（同一层上的连接）和通孔 不同的几何形状（相邻层之间的连接）。

This research is on accurate models of the electrical performance of interconnections on digital circuits. Maintenance of the fidelity of a signal as it propagates through various interconnections is a key factor in proper functioning of integrated circuits (IC's). For very high-speed IC's, there is a complicated electromagnetic nature of the signal propagation. Accurate models of the complex interconnection structures are difficult to obtain. In the model being developed transient responses of signal propagation through interconnections are represented by the three-dimensional, full-wave, finite difference solution of Maxwell's equations in the time domain. This solution is being developed to conform to the interconnection geometries found in multilayer IC's. Attention is being paid to excitation and absorbing boundary conditions to ensure a high degree of numerical accuracy. Various interconnection structures are being analyzed, with special consideration being given to bends of different angles (connections on the same layer) and vias of different geometries (connections between adjacent layers).