Development of Efficient and Accurate Numerical Techniques for the Design of Embedded Three Dimensional RF Components

该项目是关于3D嵌入式射频组件设计的快速和准确的计算技术。所要研究的数值方法是基于全波混合势积分方程组，该方法能够精确地模拟三维相互作用，并且能够处理具有不同介电常数的任意多层介质。在多层并矢格林函数的快速计算、阻抗矩阵的快速矩阵求解、高阶基函数和快速扫频技术方面，将探索关键的数学和算法突破。我们的初步研究结果表明，对于多层介质中的3D射频组件，可以开发出比目前软件工具中使用的技术更好的特殊数值技术，并可能对无线系统的设计产生重大影响。该项目还将为大学团队成员与产业合作伙伴国家半导体公司之间的密切互动提供机会。这一努力将加强参与的大学在工程和应用数学方面的研究生教育，而产业界将受益于大学创新和探索性研究的潜在根本性突破。

This project is on fast and accurate computational techniques for the design of 3D embedded RF components. The numerical method to be investigated is based on a full-wave Mixed Potential Integral Equation formulation that has the capability of providing accurate modeling of 3-D interactions and handling arbitrary multi-layered media with different dielectric constants. Critical mathematical and algorithmic breakthroughs will be explored in the areas of fast calculation of multi-layered dyadic Green's functions over substrate, fast matrix solution of impedance matrices, high order basis functions, and fast frequency sweep techniques. Promising results from our initial investigations indicate that special numerical techniques superior to the techniques used in present software tools can be developed for 3D RF components in multi-layered media, and may lead to significant impact to the design of wireless systems. This project will also provide an opportunity for close interactions among the university team members and National Semiconductor Corporation - the industrial partner. Such an effort will strengthen the graduate education in both engineering and applied mathematics at participating universities, while industry will be benefited by potential fundamental breakthroughs of innovative and exploring research at universities.