A High Throughput Parallel Processing System Using Three Dimensional Optoelectronic Interconnect

9422452 Wills本活动将研究具有三维光学互连网络的高度并行计算机。 这款极其紧凑的系统旨在处理图像处理等应用中的高吞吐量数据流。 高密度和大的I/O带宽来自基于Si的处理器之间的光通信信道。 通过使用在硅对之透明的波长下操作的集成光电子器件，在堆叠的硅电路之间形成穿过晶片的垂直光通信信道。 薄膜光电子器件直接键合到SI集成电路，以实现这种独立的垂直光学互连。 为了构建该系统，通过标准IC代工厂制造包含数字处理器、网络接口和路由器的硅芯片，以及用于薄膜设备的模拟接口电路。 然后使用标准的、低成本的、高产量的微制造技术对芯片进行后处理以集成薄膜光电器件。 然后将这些芯片的二维平面堆叠以形成由垂直光学通道连接的三维系统。 长期来看，使用集成的贯穿晶片的光学互连将导致极其密集的系统（在四英寸的晶片中有4096个处理器）。 具有高吞吐量的立方体（820 Gbits/sec外部I/O带宽，3.2 Tbits/sec聚合带宽）。 拟议的系统将加速建立一个跨学科的教师和学生在并行计算架构，模拟电路，光电器件和集成，晶体生长等领域的合作小组。 正是这种类型的合作，使实现一个革命性的，主要是电子系统与简单的点对点光电互连，并有助于确定每个研究人员的关键点和权衡，必须考虑从系统的角度。

9422452 Wills This activity will study a highly parallel computer that features a three dimensional, optical interconnection network. The extremely compact system is design to process high throughput data streams in applications such as image processing. The high density and large I/O bandwidth result from optical communication channels between Si-based processors. By using integrated optoelectronic devices operating at wavelengths to which silicon is transparent, through-wafer vertical optical communications channels are formed between stacked silicon circuitry. Thin film optoelectronic devices are bonded directly to SI integrated circuits to realize this self contained vertical optical interconnect. To construct the system, silicon chips containing a digital processor, network interface, and router, plus analog interface circuitry for the thin film devices, are fabricated through a standard IC foundry. The chips are then post processed to integrate the thin film optoelectronic devices using standard, low cost, high yield microfabrication techniques. Two dimensional planes of these chips are then stacked to form the three dimensional system which is connected by the vertical optical channels. The use of integrated through-wafer optical interconnect will lead, long term, to extremely dense systems (4096 processors in a four inch cube with high throughput (820 Gbits/sec external I/O bandwidth, 3.2 Tbits/sec aggregate bandwidth). The proposed system will accelerate an established, interdisciplinary collaborative group of faculty and students in the areas of parallel computational architectures, analog circuits, optoelectronic devices and integration, and crystal growth. It is this type of collaboration that enables the realization of a revolutionary, predominantly electronic system with simple point-to-point optoelectronic interconnects, and helps to identify for each of the researchers the critical points and trade-offs which must be considered from a system perspective.