Japan JSPS Program: Surface Chemistry Relevant to Copper Chemical Vapor Deposition

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9503889 Tindall This award supports a one year Japan Society for the Promotion of Science postdoctoral fellowship for Dr. Craig Tindall. The research work conducted for this fellowship will be performed in Professor Toshio Sakurai's laboratory at the Institute for Materials Research (IMR) at Tohoku University. The proposed work consists of fundamental studies of copper compounds on silicon and silicon dioxide surfaces. These materials are of interest because more knowledge of their chemistry will help to create processes which may be used to make faster integrated circuits. As a postdoctoral fellow at IMR, Dr. Tindall will have the opportunity to become familiar with some very powerful experimental apparatus which has been developed by Professor Sakurai's group. Since this equipment is not readily available in other laboratories, Professor Sakurai's laboratory will provide an excellent environment in which to perform this research. In addition, the Electro- Communication Institute at Tohoku University is also a very highly regarded facility, and may provide an opportunity in the second year of this fellowship to carry out some studies of deposition of copper layers on silicon and silicon dioxide. ***