International Postdoctoral Fellows Program: Development andRealization of High Temperature Integrated Sensor Amplifiersin 6H and 3C Silicon Carbide

9507123谢泼德国际初级研究员和博士后研究员计划使美国科学家和工程师能够在国外进行3至24个月的研究。该项目的奖项提供了联合研究的机会，并提供了使用国外独特或互补的设施、专业知识和实验条件的机会。该奖项将支持斯科特·T·谢泼德博士为期12个月的博士后研究访问，与埃克哈德·尼曼博士在德国法兰克福的戴姆勒-奔驰股份公司研究所合作。该研究项目将开发与戴姆勒-奔驰公司正在开发的碳化硅微传感器集成的碳化硅集成电路技术。其总体目标是一种智能传感器技术，它是半导体微传感器(压力、加速度、挠度)及其相应的驱动和读出电路的组合。研究将分三步进行：1)开发和验证适用于高达500摄氏度的碳化硅的新的SPICE电路模型；2)实现新的SPICE模型以研究碳化硅中不同类型的放大电路；以及3)制造和演示适合与微传感器传感器和紫外光二极管集成的IC放大器原型。***

9507123 Sheppard The International Junior Investigator and Postdoctoral Fellows Program enables U.S. scientists and engineers to conduct three to twenty-four months of research abroad. The program's awards provide opportunities for joint research, and the use of unique or complementary facilities, expertise and experimental conditions abroad. This award will support a twelve-month postdoctoral research visit by Dr. Scott T. Sheppard to work with Dr. Ekkehard Niemann at the Research Institute of Daimler Benz AG in Frankfurt, Germany. This research project will develop silicon carbide (SiC) integrated circuit technology for integration with SiC microsensors being developed at Daimler-Benz. The general goal is a smart sensor technology, which is a combination of a semiconductor microsensor (pressure, acceleration, deflection) and its corresponding driving and readout circuit. The research will be done in three steps: 1) Development and verification of new SPICE circuit models for SiC up to 500 degrees Celsius; 2) Implementation of new SPICE models to investigate different types of amplifier circuits in SiC; and 3) Fabrication and demonstration of a prototype IC amplifier suitable for integration with microsensor tranducers and UV photodiodes. ***