GOALI: THz Interconnect for Ultra-High Performance Microelectronics

9521030未来的Grischkowsky超高密度、超高速数字计算将需要在0.1um/sub0.1um的最小特征尺寸环境中沿导线和直接通过自由空间发送和接收ps/subps电磁信号。这种互连要求在很大程度上与有源器件类型的最终选择无关。使用光电子学技术产生ps/subps波形，我们将证明导波传播效应必须在电子芯片级别上考虑。通过我们的测量，我们将生成一个知识库，在此基础上可以设计出现实的基于传输线的导线互连。利用光电子学技术，我们将演示自由空间、芯片到芯片和自由传播波、片上太赫兹互连。我们相信，该项目将为超高性能互连的发展设定重要的新方向，并将为未来理想的超高性能有源器件的特征带来一个全新的视角。***

9521030 Grischkowsky Ultra-dense, ultra-fast digital computing of the future will require the transmission and reception of ps/subps electromagnetic signals along wires and directly through free space, in a 0.1 um/sub-0.1 um minimum feature size environment. This interconnect requirement is largely independent of the ultimate choice of the type of active device. Using optoelectronic techniques to generate ps/subps waveforms, we will have demonstrated that guided wave propagation effects must be considered on the electronic chip level. Through our measurements, we will have generated a knowledge base on which a realistic transmission-line based wire interconnect could be designed. Using optoelectronic techniques, we will have demonstrated both free-space, chip-to-chip and freely propagating wave, on-chip THz interconnects. We believe this project will set important new directions for the development of ultrahigh performance interconnect and will also lead to a whole new perspective on the characteristics of ideal ultrahigh performance active devices of the future. ***